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PDF CPC1317P Data sheet ( Hoja de datos )

Número de pieza CPC1317P
Descripción Single-Pole OptoMOS Relay
Fabricantes IXYS 
Logotipo IXYS Logotipo



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No Preview Available ! CPC1317P Hoja de datos, Descripción, Manual

INTEGRATED CIRCUITS DIVISION
CPC1317
Single-Pole OptoMOS® Relay
with Bidirectional Transient Protection
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
LED Current to Operate
Rating
70
150
16
1
Units
VP
mArms / mADC
mA
Transient Protection Characteristics
Peak Pulse Power
600W
VWM
40.2V
Features
Meets Requirements of EN50130-4
(Installation Class 3)
3750Vrms Input/Output Isolation
100% Solid State
Low Drive Power Requirements
(TTL/CMOS Compatible)
No Moving Parts
High Reliability
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
Security
Sensor Circuitry
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Aerospace
Industrial Controls
Description
The CPC1317 is a single-pole, normally open
(1-Form-A) solid state relay with bi-directional
transient voltage suppressor (TVS) relay protection,
which is designed to meet the requirements of
EN50130-4 (installation class 3).
The relay output is constructed with efficient
MOSFET switches and photovoltaic die that
use IXYS Integrated Circuits Division's patented
OptoMOS architecture. The input, a highly efficient
GaAlAS infrared LED, controls the optically coupled
output.
The CPC1317 is available in an 8-pin, space-saving
surface-mount package.
Approvals
UL Certified Component: File E76270
CSA Certified Component: Certificate 1172007
EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 006
Ordering Information
Part #
CPC1317P
CPC1317PTR
Description
8-Pin Flatpack (50/tube)
8-Pin Flatpack (1000/reel)
Pin Configuration
1
2
3
+ Control
4
– Control
8
TVS +/-
7
TVS -/+
6
Load
5
Load
Pb
DS-CPC1317-R05
e3
Switching Characteristics
of Normally Open Devices
Form-A
I
F
ILOAD
90%
ton
10%
toff
www.ixysic.com
1

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CPC1317P pdf
INTEGRATED CIRCUITS DIVISION
CPC1317
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
CPC1317P
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
CPC1317P
Maximum Temperature x Time
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb e3
R05 www.ixysic.com
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