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PDF RT8296A Data sheet ( Hoja de datos )

Número de pieza RT8296A
Descripción 340kHz Synchronous Step-Down Converter
Fabricantes Richtek 
Logotipo Richtek Logotipo



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RT8296A
3A, 23V, 340kHz Synchronous Step-Down Converter
General Description
Features
The RT8296A is a high efficiency, monolithic synchronous
step-down DC/DC converter that can deliver up to 3A
output current from a 4.5V to 23V input supply. The
RT8296A's current mode architecture and external
compensation allow the transient response to be
optimized over a wide range of loads and output capacitors.
Cycle-by-cycle current limit provides protection against
shorted outputs and soft-start eliminates input current
surge during start up. Fault conditions also include output
under voltage protection and thermal shutdown. The low
current (<3μA) shutdown mode provides output
disconnect, enabling easy power management in battery
powered systems. The RT8296A is available in a
SOP-8 (Exposed Pad) package.
z ±1.5% High Accuracy Feedback Voltage
z 4.5V to 23V Input Voltage Range
z 3A Output Current
z Integrated N-MOSFET Switches
z Current Mode Control
z Fixed Frequency Operation : 340kHz
z Output Adjustable from 0.8V to 20V
z Up to 95% Efficiency
z Programmable Soft-Start
z Stable with Low ESR Ceramic Output Capacitors
z Cycle-by-Cycle Over Current Protection
z Input Under Voltage Lockout
z Output Under Voltage Protection
z Thermal Shutdown Protection
z RoHS Compliant and Halogen Free
Ordering Information
RT8296A
Applications
Note :
Package Type
z Industrial and Commercial Low Power Systems
SP : SOP-8 (Exposed Pad-Option 1) z Set Top Box
Lead Plating System
LCD Monitors and TVszhttp://www.DataSheet4U.net/
G : Green (Halogen Free and Pb Free) z Green Electronics/Appliances
Z : ECO (Ecological Element with
Halogen Free and Pb free)
z Point of Load Regulation of High Performance DSPs
H : UVP Hiccup
z Wireless AP/Router
L : UVP Latch-Off
Pin Configurations
Richtek products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
(TOP VIEW)
BOOT
VIN
SW
GND
8
27
GND
36
9
45
SS
EN
COMP
FB
Marking Information
RT8296AxGSP
RT8296Ax
GSPYMDNN
RT8296AxGSP : Product Number
x : H or L
YMDNN : Date Code
SOP-8 (Exposed Pad)
RT8296AxZSP
RT8296Ax
ZSPYMDNN
RT8296AxZSP : Product Number
x : H or L
YMDNN : Date Code
DS8296A-03 March 2011
www.richtek.com
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RT8296A pdf
RT8296A
Parameter
Input Under Voltage Lockout
Threshold
Input Under Voltage Lockout
Threshold Hysteresis
EN Threshold Logic-High
Voltage
Logic-Low
Soft-Start Current
Soft-Start Period
Thermal Shutdown
Symbol
VIH
VIL
ISS
tSS
TSD
Test Conditions
VIN Rising
VSS = 0V
CSS = 0.1µF
Min Typ Max Unit
3.8 4.2 4.5
V
-- 320 --
2.7 -- 5.5
-- -- 0.4
-- 6 --
-- 13.5 --
-- 150 --
mV
V
µA
ms
°C
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θJA is measured in natural convection at TA = 25°C on a high effective thermal conductivity four-layer test board of
JEDEC 51-7 thermal measurement standard. The measurement case position of θJC is on the exposed pad of the
package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
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DS8296A-03 March 2011
www.richtek.com
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RT8296A arduino
RT8296A
The output ripple, VOUT , is determined by :
VOUT
IL
ESR +
1
8fCOUT

inrush of current through the long wires can potentially
cause a voltage spike at VIN large enough to damage the
part.
The output ripple will be highest at the maximum input
voltage since IL increases with input voltage. Multiple
capacitors placed in parallel may be needed to meet the
ESR and RMS current handling requirement. Dry tantalum,
special polymer, aluminum electrolytic and ceramic
capacitors are all available in surface mount packages.
Special polymer capacitors offer very low ESR value.
However, it provides lower capacitance density than other
types. Although Tantalum capacitors have the highest
capacitance density, it is important to only use types that
pass the surge test for use in switching power supplies.
Aluminum electrolytic capacitors have significantly higher
ESR. However, it can be used in cost-sensitive applications
for ripple current rating and long term reliability
considerations. Ceramic capacitors have excellent low
ESR characteristics but can have a high voltage coefficient
and audible piezoelectric effects. The high Q of ceramic
capacitors with trace inductance can also lead to significant
ringing.
Higher values, lower cost ceramic capacitors are now
becoming available in smaller case sizes. Their high ripple
current, high voltage rating and low ESR make them ideal
for switching regulator applications. However, care must
be taken when these capacitors are used at input and
output. When a ceramic capacitor is used at the input
and the power is supplied by a wall adapter through long
wires, a load step at the output can induce ringing at the
input, VIN. At best, this ringing can couple to the output
and be mistaken as loop instability. At worst, a sudden
Checking Transient Response
The regulator loop response can be checked by looking
at the load transient response. Switching regulators take
several cycles to respond to a step in load current. When
a load step occurs, VOUT immediately shifts by an amount
equal to ILOAD (ESR) also begins to charge or discharge
COUT generating a feedback error signal for the regulator
to return VOUT to its steady-state value. During this
recovery time, VOUT can be monitored for overshoot or
ringing that would indicate a stability problem.
EMI Consideration
Since parasitic inductance and capacitance effects in PCB
circuitry would cause a spike voltage on SW pin when
high side MOSFET is turned-on/off, this spike voltage on
SW may impact on EMI performance in the system. In
order to enhance EMI performance, there are two methods
to suppress the spike voltage. One is to place an R-C
snubber between SW and GND and make them as close
h as pot ssibtle to tp he SW: pin/ (see/ Figuw re 5).w Anotw her m. ethoD d
is adding a resistor in series with the bootstrap
capacitor, CBOOT. But this method will decrease the driving
capability to the high side MOSFET. It is strongly
recommended to reserve the R-C snubber during PCB
layout for EMI improvement. Moreover, reducing the SW
trace area and keeping the main power in a small loop will
be helpful on EMI performance. For detailed PCB layout
guide, please refer to the section of Layout Consideration.
VIN
4.5V to 23V
Chip Enable
REN*
CEN*
2 VIN
CIN
BOOT 1
10µF x 2
RT8296A
SW 3
7 EN
CSS
0.1µF
8 SS
4,
9 (Exposed Pad)
GND
FB 5
COMP 6
RBOOT*
CBOOT
100nF
10LµH
RS*
CS*
CC
3.3nF
RC
13k
R1
75k
R2
24k
VOUT
3.3V/3A
COUT
22µFx2
a
t
* : Optional
CP
NC
Figure 5. Reference Circuit with Snubber and Enable Timing Control
DS8296A-03 March 2011
www.richtek.com
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