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PDF HSDL-3003 Data sheet ( Hoja de datos )
| Número de pieza | HSDL-3003 | |
| Descripción | IrDA Data Compliant Low Power | |
| Fabricantes | Agilent | |
| Logotipo |  |
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Agilent HSDL-3003
IrDA® Data Compliant Low Power
115.2 kbit/s with Remote Control
Infrared Transceiver
Data Sheet
Description
The HSDL-3003 is a small form
factor enhanced infrared (IR)
transceiver module that provides
the capability of (1) interface
between logic and IR signals for
through-air, serial, half-duplex IR
data link, and (2) IR remote
control transmission operating at
the optimum 940 nm wavelength
for universal remote control
applications.
For IR data communication, the
HSDL-3003 provides the
flexibility of low power SIR
applications and remote control
applications with no external
components needed for the
selection of the type of
application. The transceiver is
compliant to IrDA® Physical
IrDA® Data Features
• Fully compliant to IrDA® Physical
Layer Specification 1.4 low power
from 9.6 kbit/s to 115.2 kbit/s (SIR)
– Excellent nose-to-nose operation
– Link diswtwawn.DcateaShuepet4Uto.com50 cm
typically
• Complete shutdown for TxD_IrDA,
RxD_IrDA, and PIN diode
• Low power consumption
– Low idle current, 50 µA
typically
– Low shutdown current, 10 nA
typically
• LED stuck-high protection
General Features
• Guaranteed temperature
performance, –20° to 70°C
– Critical parameters are
guaranteed over temperature
and supply voltage
• Low power consumption
• Small module size
– Height: 2.70 mm
– Width: 8.00 mm
– Depth: 2.95 mm
• Minimum external components
– Integrated single-biased LED
resistor
– Direct interoperability to MPU
– Programmable Txd features
– Integrated remote control FET
• Withstands >100 mVp-p power
supply ripple typically
• VCC supply 2.4 to 3.6 volts
• Integrated EMI shield
• Designed to accommodate light
loss with cosmetic windows
• IEC 825-Class 1 eye safe
Applications
• Mobile data communication and
universal remote control
transmission
– Personal digital assistants
(PDAs)
– Mobile phones
Remote Control Features
• Wide angle and high radiant
intensity
• Spectrally suited to remote
control transmission function at
940 nm typically
• Typical link distance up to 8
meters
CAUTION: The BiCMOS inherent to this design of this component increases the component’s
susceptibility to damage from Electrostatic Discharge (ESD). It is advised that normal static
precautions be taken in handling and assembly of this component to prevent damage and/or
degradation, which may be induced by ESD.
1 page  
Absolute Maximum Ratings at TA = 25°C
For implementations where case to ambient thermal resistance is ≤ 50°C/W
Parameter
Symbol
Min. Max.
Storage Temperature
TS -40 100
Operating Temperature
TA -20 70
LED Supply Voltage
VLED 0 6
Supply Voltage
VCC 0 6
Output Voltage: RxD
VO 0 6
Total LED Current Pulse Amplitude
IVLED
580
IR LED Current Pulse Amplitude
(IVLED)IR
280
RC LED Current Pulse Amplitude
(IVLED)RC
580
Units
°C
°C
V
V
V
mA
mA
mA
Conditions
≤ 90 µs Pulse Width
≤ 20% Duty Cycle
≤ 90 µs Pulse Width
≤ 20% Duty Cycle
≤ 90 µs Pulse Width
≤ 20% Duty Cycle
Recommended Operating Conditions
Parameter
Symbol
Operating Temperature
TA
Supply Voltage
VCC
LED Supply Voltage
VLED
Logic Input Voltage Logic High VIH
for TxD_IrDA, TxD_RC Logic Low VIL
Receiver Input
Irradiance
Logic High EIH
Logic Low EIL
TxD_IrDA Pulse Width (SIR)
tTPW(SIR)
Receiver Data Rate
Min. Max. Units Conditions
-20 70 °C
2.4 3.6 V
2.4 4.5
www.DataSheet4U.com
2/3 VCC VCC
V
V
0 1/3 VCC V
0.0081 500 mW/cm2 For in-band signals ≤ 115.2 kbit/s[3]
0.3 µW/cm2 For in-band signals[3]
1.5 1.6 µs
9.6 115.2 kbit/s
5
5 Page 
Moisture Proof Packaging
All HSDL-3003 options are
shipped in moisture proof
package. Once opened, moisture
absorption begins.
This part is compliant to JEDEC
Level 4.
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
PACKAGE IS
OPENED (UNSEALED)
ENVIRONMENT
LESS THAN 25°C,
AND LESS THAN
60% RH?
NO
PACKAGE IS
OPENED MORE
THAN 72 HOURS?
YES
YES
www.DataSheet4U.com
NO BAKING
IS NECESSARY
NO
PERFORM RECOMMENDED
BAKING CONDITIONS
Figure 14. Baking conditions chart.
Baking Conditions
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
Package
In reels
In bulk
Temp.
60°C
100°C
125°C
150°C
Time
≥ 48 hours
≥ 4 hours
≥ 2 hours
≥ 1 hour
Baking should only be done once.
Recommended Storage Conditions
Storage Temperature 10°C to 30°C
Relative Humidity below 60% RH
Time from Unsealing to Soldering
After removal from the bag, the
parts should be soldered within
two days if stored at the recom-
mended storage conditions. If
times longer than 72 hours are
needed, the parts must be stored
in a dry box.
11
11 Page | ||
| Páginas | Total 21 Páginas | |
| PDF Descargar | [ Datasheet HSDL-3003.PDF ] | |
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