BAP70AM の電気的特性と機能

BAP70AMのメーカーはNXP Semiconductorsです、この部品の機能は「Silicon PIN Diode Array」です。

製品の詳細 ( Datasheet PDF )

部品番号 BAP70AM
部品説明 Silicon PIN Diode Array
メーカ NXP Semiconductors
ロゴ NXP Semiconductors ロゴ 


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BAP70AM Datasheet, BAP70AM PDF,ピン配置, 機能
Silicon PIN diode array
Rev. 01 — 20 November 2006
Product data sheet
1. Product profile
1.1 General description
Four planar PIN diode array in SOT363 small SMD plastic package.
1.2 Features
I High voltage current controlled RF resistor for RF attenuators
I Low diode capacitance
I Very low series inductance
I Low distortion
1.3 Applications
I RF attenuators
I (SAT) TV applications
I Car radio applications
2. Pinning information
Table 1. Discrete pinning
Pin Description
1 anode diode 1
2 cathode diode 2
3 anode diode 3 / cathode diode 4
4 anode diode 4
5 cathode diode 3
6 anode diode 2 / cathode diode 1
Simplified outline Symbol
3. Ordering information
Table 2. Ordering information
Type number Package
Name Description
plastic surface-mounted package; 6 leads

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BAP70AM pdf, ピン配列
NXP Semiconductors
7. Characteristics
Table 6. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
VF forward voltage
IF = 50 mA
IR reverse current
VR = 50 V
diode capacitance
see Figure 1; f = 1 MHz;
VR = 0 V
VR = 1 V
VR = 5 V
VR = 20 V
rD diode forward resistance see Figure 2; f = 100 MHz;
IF = 0.5 mA
IF = 1 mA
IF = 10 mA
IF = 100 mA
τL charge carrier life time when switched from IF = 10 mA to
IR = 6 mA; RL = 100 ; measured at
IR = 3 mA
series inductance
IF = 100 mA; f = 100 MHz
Silicon PIN diode array
Min Typ Max Unit
- 0.9 1.1 V
- - <100 nA
- 570 - fF
- 400 - fF
- 270 - fF
- 200 250 fF
- 77 100
- 40 50
5.4 7
- 1.4 1.9
- 1.25 - µs
- 0.6 - nH
5 10 15 20
VR (V)
f = 1 MHz; Tj = 25 °C.
Fig 1. Diode capacitance as a function of reverse
voltage; typical values
10 102
IF (mA)
f = 100 MHz; Tj = 25 °C.
Fig 2. Diode forward resistance as a function of
forward current; typical values
Product data sheet
Rev. 01 — 20 November 2006
© NXP B.V. 2006. All rights reserved.
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BAP70AM 電子部品, 半導体
NXP Semiconductors
Silicon PIN diode array
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet Development
Preliminary [short] data sheet Qualification
Product [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
11.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For additional information, please visit:
For sales office addresses, send an email to: [email protected]
Product data sheet
Rev. 01 — 20 November 2006
© NXP B.V. 2006. All rights reserved.
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Silicon PIN Diode Array

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