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PDF RVGxxxx Data sheet ( Hoja de datos )
| Número de pieza | RVGxxxx | |
| Descripción | Chip Trimmer Potentiometer | |
| Fabricantes | Murata | |
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Hay una vista previa y un enlace de descarga de RVGxxxx (archivo pdf) en la parte inferior de esta página. Total 23 Páginas | ||
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This is the PDF file of catalog No.R82E-2.
R82E2.pdf 97.09.29
CHwIPwTwR.IDMaMtEaRSPhOeTeEtN4TUIO.cMoEmTER
APPLICATION MANUAL
Murata
Manufacturing Co., Ltd.
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1 page  
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This is the PDF file of catalog No.R82E-2.
1 Features and Specifications
R82E2.pdf 97.09.29
2. Specifications
Item
Series
POZ3 Series RVG3 Series RVG4M Series POG5 Series
Resistive element
material
Terminal layout
No. of terminals
Adjustment method
Soldering
Electrode surface
treatment
Size
Product thickness
Product weight
Cleaning
Lock painting
Taping packaging
(reel with a diameter
of 180 mm)
Cermet
Carbon
Triangular
3 (divider type)V1
Automatic
Manual
Reflow soldering
Flow soldering
Gold plating(nickel undercoating)
Solder plating (nickel undercoating)
V3 V3 V3 V3
Solder plating (copper undercoating)
3 mm square
4 mm square
www.DataSheet4U.com5 mm square
1.50mm
1.85mm
2.00mm
2.10mm
3.70mm
5.00mm
0.040g(40mg)
0.080g(80mg)
0.180g(180mg)
Necessary V2
Not necessary
Possible
Not possible
250 pcs./reel
500 pcs./reel
1500 pcs./reel
2000 pcs./reel
2500 pcs./reel
(2)
V1 (1)
(3) They can be used as the rheostat type by connecting lands (2) and (3). (2 terminals (rheostat type) (1)
V2 Cleaning is needed only when there is an adhesion of foreign matter such as flux on the resistive element.
V3 Only terminal (2) is gold-plated with a nickel undercoat.
(2) )
4
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5 Page 
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This is the PDF file of catalog No.R82E-2.
5 Chip Mounting Process
R82E2.pdf 97.09.29
1. Solder Paste Stenciling
The Amount of Solder Paste
According to the figure on the right, apply the
appropriate amount of solder paste with a stencil so that
the solder covers the side face of the electrode.
If the amount of solder paste applied to the land is
insufficient, the required adhesive strength cannot be
obtained. If an excessive amount of solder paste is
applied, solder bridging or flux overflow to the resistive
element surface can occur. Standard thicknesses of
solder coating are listed in the table on the right.
Electrode
Solder
Series
POZ3AN, RVG3A, RVG4M, POG5
POZ3KN
Standard applying thickness
150e200 µ m
100e150 µ m
2. Mounting the Product
When mounting the product, pay attention to the
following points.
Dimensions of the Positioning Claws
qRecommended Thickness of the Positioning Claws
In chip placers which mechanically determine the pick-
up position, check the dimensions of the positioning
Claw
Product
claws, referring to the figure on the right. The width of
each claw should be such that it cannot be inside the
www.DataSheet4U.comspace between terminals (1) and (3). If it is inside the
space between them, the product may get out of place or
air leakage may occur.
qWidth of the Positioning Claws
Claw
T= 2.0 mm or more
Product
W
W= 4.0 mm or more
Correct
Claw
Terminal (3)
Terminal (1)
Incorrect
Dimensions of the Pick-up Nozzle
The size of the pick-up nozzle should fit the suction
surface of each product. There are two nozzle types as
shown on the right in the figure. Use the suitable type for
each series as indicated here.
Recommended for the POZ3 and RVG3 Series
2.5—2.8mm
2.0mm
Recommended for the RVG4M and POG5 Series
4.0mm
2.0mm
Pressure
The pressure from the pick-up nozzle should be 100 gf to
300 gf of static load.
10
A nozzle whose suction surface is flat and free of notches or
V grooves is recommended.
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| Páginas | Total 23 Páginas | |
| PDF Descargar | [ Datasheet RVGxxxx.PDF ] | |
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