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PDF HSDL-1000 Data sheet ( Hoja de datos )
| Número de pieza | HSDL-1000 | |
| Descripción | General Application Guide for the HSDL-1100 4 Mb/s Infrared Transceiver | |
| Fabricantes | Agilent(Hewlett-Packard) | |
| Logotipo | .gif "Agilent(Hewlett-Packard)"){kind=logo} |
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H
Infrared IrDA® Compliant
Transceiver
Technical Data
HSDL-1000
Features
• Low Cost Infrared Data Link
• Guaranteed to Meet IrDA
Physical Layer Specifications
1 cm to 1 Meter Operating
Distance
30° Viewing Angle
2.4 KBd to 115.2 KBd Data
Rate
• Daylight Cancellation
• Easily Implemented Direct
Connection to Various I/O
Chips
• Small Form Factor
• Several Lead and Shipping
Configurations Available
• Excellent EMI Immunity
(> 10 V/m)
Applications
• Data Comm: Serial Data
Transfer Between:
Notebook Computers
Subnotebooks
Desktop PCs
PDAs
Printers
Other Peripheral Devices
• Telecom:
Modem, Fax, Pager, Phone
• Industrial:
Data Collection Devices
• Medical:
Patient and Pharmaceutical
Data Collection
Description:
The HSDL-1000 serial infrared
module performs low cost, low
power, point-to-point, through the
air data transfer in a serial, half-
duplex mode.
The module has been designed to
the IrDA (Infrared Data Associa-
tion) Physical Layer Specifica-
tions. The module is designed to
operate from 0 to 1 meter at a
data rate of 115.2 Kbd per second
at a 30° viewing angle.
The HSDL-1000 contains a high
speed, high efficiency TS AlGaAs
875 nm LED, a PIN Silicon photo-
diode and an integrated circuit.
The IC contains an LED driver,
amplifiers and a quantizer.
The module is designed to inter-
face directly with selected I/O
chips that incorporate logic which
performs pulse width modulation/
demodulation.
V+
Schematic
LED C
RLED
LED A
BUTTRESS
LEAD*
PIN ONE
TXD
RXD
RI TXD
LED
VPIN
RXD
CX1
PHOTODIODE
COMPARATOR
HP 1000
YYWW
PIN ONE
INDICATOR
PIN ONE
V+ VCC
CX4 CX3
GND
CX2
CX2
GND
+
VPIN
5964-9641E
* SIDE BUTTRESS LEADS ARE FOR MECHANICAL STABILITY AND
SHOULD NOT BE CONNECTED TO ANY ELECTRICAL POTENTIAL.
4-33
1 page  
Infrared Reflow Profile
300
t2 = 11.5 ± .5 MINS. (SOLDER JOINT)
250 T (MAX.) = 250 °C OR 235 °C (+5-0) °C
ANY PART OF COMPONENT BODY
t1 = 8 ± 1 MINS. (SOLDER JOINT)
200
185 °C
150
3.5 ± .5 MINS.
(SOLDER JOINT)
100
50
0
0
T > 120 °C FOR t
GREATER THAN 2.5 MINS.
(SOLDER JOINT)
2468
TIME (t)
dT/dt < 3 °C/SEC.
10 12 14
Recommended Operating Conditions
Parameter
Symbol Min.
Operating Temperature
Supply Voltage
Logic High Transmitter Input Voltage
Logic Low Transmitter Input Voltage
Logic High Receiver Input Irradiance
(870 nm)
Logic Low Receiver Input Irradiance
LED (Logic High) Current Pulse
Amplitude
Receiver Set-up Time
TA
VCC
VIH (TXD)
VIL (TXD)
EIH
EIL
ILEDA
0°
4.5
2.5
0.0
0.0036
250
10
Signal Rate
Ambient Light
2.4
Max.
70°
5.5
5.5
0.3
500
0.3
116
Units
C
V
V
V
mW/cm2
Conditions
For in-band signals*
µW/cm2
mA
ms
Kp/s
For in-band signals*
For one metre links with
daylight filters
For full sensitivity after
transmitting
See IrDA Serial Infrared
Physical Layer Link Speci-
fication, Appendix A for
ambient levels. See Rx
TH+ section at the end
of this data sheet also.
*Note: An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 nm ≤ λp ≤ 900 nm, the pulse
repetition rate, PRR, is defined as 2.4 Kp/s ≤ PRR ≤ 115.2 Kp/s and the pulse width, PW, is defined as 1.6 s ≤ PW ≤ (3/16)/PRR.
4-37
5 Page | ||
| Páginas | Total 10 Páginas | |
| PDF Descargar | [ Datasheet HSDL-1000.PDF ] | |
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