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PDF SMP-0SCMC Data sheet ( Hoja de datos )
| Número de pieza | SMP-0SCMC | |
| Descripción | Trisil for telecommunication equipment protection | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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SMP-0SCMC
Trisil™ for telecommunication equipment protection
Features
■ Bidirectional crowbar protection
■ Repetitive peak pulse current
(Tamb -40 °C to +85 °C)
– IPP = 100 A (10/1000 µs)
– IPP = 200 A (5/310 µs)
– IPP = 500 A (2/10 µs)
■ Breakdown voltage: from 72 V to 310 V
■ Operating Tj max: 150 °C
■ Micro capacitance technology
■ JEDEC registered package outline
Complies with the following standards
■ Telcordia GR-1089
■ ITU-T K20/21/45 enhanced level
■ TIA-968
■ YD/T 950 / 993 / 1082
■ IEC 61000-4-5
■ IEC 61000-4-2 level 4
– ±15 kV (air discharge)
– ±8 kV (contact discharge)
■ MIL STD 883H - Method 3015-8 Class 3B
■ Resin meets UL 94, V0
■ MIL-STD-750, method 2026 soldererabilty
■ EIA STD RS-481 and IEC 60286-3 packing
■ IPC 7531 footprint
■ UL497B recognized, UL file E136224
Datasheet production data
SMB
(JEDEC DO-214AA)
Description
The devices in the SMP-0SCMC series are micro
capacitance Trisils designed to protect broadband
telecommunication equipment such as DSL
modems, subscriber gateways and DSLAMs from
lightning surges and power faults.
Trisils are not subject to aging and provide a
failsafe mode in short circuit for a better
protection. They are used to help equipment to
meet main standards such as UL60950, IEC950 /
CSA C22.2and UL1459.
The SMP-0SCMC series is packaged in SMB.
January 2013
This is information on a product in full production.
TM: Trisil is a trademark of STMicroelectronics
Doc ID 022779 Rev 1
1/7
www.st.com
7
1 page  
SMP-0SCMC
2 Package information
Package information
● Epoxy meets UL94, V0
● Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 4. SMB dimensions
Dimensions
Ref. Millimeters
Inches
E1
Min.
Max.
Min.
Max.
D
A1 1.90
2.45 0.075 0.096
A2 0.05
0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
E
c 0.15 0.40 0.006 0.016
A1 E 5.10 5.60 0.201 0.220
C
A2
E1 4.05
4.60 0.159 0.181
L b D 3.30 3.95 0.130 0.156
L 0.75 1.50 0.030 0.059
Figure 7. Footprint dimensions
in mm (inches)
Figure 8. Marking layout
1.62 2.60 1.62
(0.064) (0.102) (0.064)
2.18
(0.086)
5.84
(0.23)
e
xxxxx
z y ww
e: ECOPACK compliance
XXXXX: Marking
Z: Manufacturing location
Y: Year
WW: week
Doc ID 022779 Rev 1
5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet SMP-0SCMC.PDF ] | |
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