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PDF PZT2222A Data sheet ( Hoja de datos )
| Número de pieza | PZT2222A | |
| Descripción | NPN Silicon Planar Epitaxial Transistor | |
| Fabricantes | ON Semiconductor | |
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PZT2222A
NPN Silicon Planar
Epitaxial Transistor
This NPN Silicon Epitaxial transistor is designed for use in linear
and switching applications. The device is housed in the SOT−223
package which is designed for medium power surface mount
applications.
Features
• PNP Complement is PZT2907AT1
• The SOT−223 Package Can be Soldered Using Wave or Reflow
• SOT−223 Package Ensures Level Mounting, Resulting in Improved
Thermal Conduction, and Allows Visual Inspection of Soldered
Joints
• The Formed Leads Absorb Thermal Stress During Soldering,
Eliminating the Possibility of Damage to the Die
• Available in 12 mm Tape and Reel
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
(Open Collector)
VCEO 40 Vdc
VCBO 75 Vdc
VEBO 6.0 Vdc
Collector Current
IC 600 mAdc
Total Power Dissipation
up to TA = 25°C (Note 1)
PD W
1.5
Storage Temperature Range°
Tstg − 65 to +150 °C
Junction Temperature°
TJ 150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on an epoxy printed circuit board 1.575 inches x 1.575 inches x
0.059 inches; mounting pad for the collector lead min. 0.93 inches2.
THERMAL CHARACTERISTICS
Rating
Symbol
Thermal Resistance,
Junction−to−Ambient
RqJA
Lead Temperature for Soldering,
0.0625″ from case
Time in Solder Bath
TL
Value
83.3
260
10
Unit
°C/W
°C
Sec
http://onsemi.com
SOT−223 PACKAGE
NPN SILICON TRANSISTOR
SURFACE MOUNT
4
123
SOT−223 (TO−261)
CASE 318E−04
STYLE 1
COLLECTOR
2, 4
BASE
1
3
EMITTER
MARKING DIAGRAM
AYM
P1FG
G
A = Assembly Location
Y = Year
M = Month Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
PZT2222AT1G
SPZT2222AT1G
PZT2222AT3G
SOT−223
(Pb−Free)
SOT−223
(Pb−Free)
SOT−223
(Pb−Free)
1,000 Tape & Reel
1,000 Tape & Reel
4,000 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
August, 2013 − Rev. 9
1
Publication Order Number:
PZT2222AT1/D
1 page  
PZT2222A
PACKAGE DIMENSIONS
D
b1
4
HE
1 23
e1 e
0.08 (0003)
A1
E
b
A
q
L
SOT−223 (TO−261)
CASE 318E−04
ISSUE N
C
L1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M,
1994.
2. CONTROLLING DIMENSION: INCH.
MILLIMETERS
INCHES
DIM MIN
NOM MAX
MIN NOM
A 1.50 1.63 1.75 0.060 0.064
A1 0.02 0.06 0.10 0.001 0.002
b 0.60 0.75 0.89 0.024 0.030
b1 2.90 3.06 3.20 0.115 0.121
c 0.24 0.29 0.35 0.009 0.012
D 6.30 6.50 6.70 0.249 0.256
E 3.30 3.50 3.70 0.130 0.138
e 2.20 2.30 2.40 0.087 0.091
e1 0.85 0.94 1.05 0.033 0.037
L 0.20
−−−
−−−
0.008
−−−
L1 1.50 1.75 2.00 0.060 0.069
H E 6.70
7.00
7.30
0.264 0.276
q 0° − 10° 0° −
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
MAX
0.068
0.004
0.035
0.126
0.014
0.263
0.145
0.094
0.041
−−−
0.078
0.287
10°
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
1.5
0.059
ǒ ǓSCALE 6:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
PZT2222AT1/D
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