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PDF ULN2003A Data sheet ( Hoja de datos )
| Número de pieza | ULN2003A | |
| Descripción | Darlington Transistor Arrays | |
| Fabricantes | ON Semiconductor | |
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ULN2003A, ULQ2003A
High Voltage, High Current
Darlington Transistor Arrays
The seven NPN Darlington connected transistors in these arrays are
well suited for driving lamps, relays, or printer hammers in a variety of
industrial and consumer applications. Their high breakdown voltage
and internal suppression diodes insure freedom from problems
associated with inductive loads. Peak inrush currents to 500 mA
permit them to drive incandescent lamps.
The ULx2003A with a 2.7 kW series input resistor is well suited for
systems utilizing a 5.0 V TTL or CMOS Logic.
Features
•ăThese are Pb-Free Devices
2.7 k
5.0 k
1/7 ULx2003A
3.0 k
Pin 9
http://onsemi.com
16
1
SOIC-16
D SUFFIX
CASE 751B
A = Assembly Location
WL = Wafer Lot
Y = Year
WW = Work Week
G = Pb-Free Package
MARKING
DIAGRAMS
16
ULN2003AG
AWLYWW
1
16
ULQ2003AG
AWLYWW
1
Figure 1. Representative Schematic Diagram
1 16
2 15
3 14
4 13
5 12
6 11
7 10
89
(Top View)
Figure 2. Pin Connections
ORDERING INFORMATION
Device
ULN2003ADR2G
Package
SOIC-16
(Pb-Free)
Shipping†
2500 Tape & Reel
ULQ2003ADR2G SOIC-16 2500 Tape & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©Ă Semiconductor Components Industries, LLC, 2007
November, 2007 - Rev. 0
1
Publication Order Number:
ULN2003A/D
1 page  
ULN2003A, ULQ2003A
PACKAGE DIMENSIONS
-A-
16
1
SOIC-16
D SUFFIX
CASE 751B-05
ISSUE K
9
-B- P 8 PL
8 0.25 (0.010) M B S
-T- SEATING
PLANE
G
K
C
R X 45_
F
D 16 PL
0.25 (0.010) M T B S A S
M
J
SOLDERING FOOTPRINT*
8X
6.40
16X 1.12
1 16
16X
0.58
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC
0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
1.27
PITCH
89
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
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operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
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5
ULN2003A/D
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet ULN2003A.PDF ] | |
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