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PDF SiI9287B Data sheet ( Hoja de datos )
| Número de pieza | SiI9287B | |
| Descripción | HDMI Port Processor | |
| Fabricantes | Silicon image | |
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Hay una vista previa y un enlace de descarga de SiI9287B (archivo pdf) en la parte inferior de esta página. Total 8 Páginas | ||
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Data Brief
SiI9287B HDMI Port Processor with InstaPort
Viewing Technology
Data Brief
Document # SiI-DB-1070-B01
1 page  
Silicon Image, Inc.
Package Information
SiI9287B HDMI Port Processor with InstaPort Viewing Technology
Data Brief
ePad Requirements
The SiI9287B HDMI Port Processor with InstaPort Viewing Technology is packaged in a 72-pin 10 mm x 10 mm QFN
package with an ExposedPad™ (ePad) that is used for the electrical ground of the chip and for improved thermal transfer
characteristics. The ePad dimensions are 4.7 mm x 4.7 mm with a tolerance of ±0.15 mm. Soldering the ePad to ground
is required to meet package power dissipation requirements at full speed operation, and to correctly connect the chip
circuitry to electrical ground. A clearance of at least 0.25 mm should be designed on the PCB between the edge of the
ePad and the inner edges of the lead pads to avoid electrical shorts.
The thermal land area on the PCB can use thermal vias to improve heat removal from the package. These thermal vias
can double as ground connections, attaching internally in the PCB to the ground plane. An array of vias can be designed
into the PCB beneath the package. For optimum thermal performance, Silicon Image recommends that the via diameter
be 12 to 13 mils (0.30 to 0.33 mm) and the via barrel be plated with 1-ounce copper to plug the via. This plating helps
avoid solder wicking inside the via during the soldering process, which can result in voids in solder between the exposed
pad and the thermal land. If the copper plating does not plug the vias, the thermal vias can be tented with solder mask on
the top surface of the PCB to avoid solder wicking inside the via during assembly. The solder mask diameter should be
at least 4 mils (0.1 mm) larger than the via diameter.
Package stand-off is also a consideration. For a nominal stand-off of approximately 0.1 mm the stencil thickness of 5 to
8 mils should provide a good solder joint between the ePad and the thermal land.
Figure 3 on the next page shows the package dimensions of the SiI9287B package.
SiI-DB-1070-B01
© 2009-2010 Silicon Image, Inc. All rights reserved.
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| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet SiI9287B.PDF ] | |
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