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Datasheet MMBT1010LT1 PDF ( 特性, スペック, ピン接続図 )

部品番号 MMBT1010LT1
部品説明 PNP Silicon Driver Transistors
メーカ Motorola
ロゴ Motorola ロゴ 
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MMBT1010LT1 Datasheet, MMBT1010LT1 PDF,ピン配置, 機能
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MMBT1010LT1/D
Low Saturation Voltage
PNP Silicon Driver Transistors
MMBT1010LT1
MSD1010T1
Motorola Preferred Devices
Part of the GreenLinePortfolio of devices with energy–conserving traits.
This PNP Silicon Epitaxial Planar Transistor is designed to conserve energy
in general purpose driver applications. This device is housed in the SOT-23 and
SC–59 packages which are designed for low power surface mount
applications.
Low VCE(sat), < 0.1 V at 50 mA
COLLECTOR
Applications
LCD Backlight Driver
Annunciator Driver
General Output Device Driver
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
BASE
EMITTER
Value
Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current — Continuous
V(BR)CBO
V(BR)CEO
V(BR)EBO
IC
45
15
5.0
100
Vdc
Vdc
Vdc
mAdc
DEVICE MARKING
PNP GENERAL
PURPOSE DRIVER
TRANSISTORS
SURFACE MOUNT
MMBT1010LT1
CASE 318–07, STYLE 6
SOT-23
MSD1010T1
MMBT1010LT1 = GLP
MSD1010T1 = GLP
THERMAL CHARACTERISTICS
Rating
Power Dissipation
TA = 25°C
Derate above 25°C
Symbol
PD(1)
Max
225
1.8
Unit
mW
mW/°C
CASE 318D–03, STYLE 1
SC-59
Thermal Resistance Junction to Ambient
Junction Temperature
Storage Temperature Range
ELECTRICAL CHARACTERISTICS
RθJA
TJ
Tstg
556
150
– 55 ~ + 150
°C/W
°C
°C
Characteristic
Symbol
Condition
Min Max Unit
Collector-Emitter Breakdown Voltage
V(BR)CEO
IC = 10 mA, IB = 0
15 — Vdc
Emitter-Base Breakdown Voltage
V(BR)EBO
IE = 10 µA, IE = 0
5.0 — Vdc
Collector-Base Cutoff Current
ICBO
VCB = 20 V, IE = 0
— 0.1 µA
Collector-Emitter Cutoff Current
ICEO
VCE = 10 V, IB = 0
DC Current Gain
hFE1(2)
VCE = 5 V, IC = 100 mA
300
Collector-Emitter Saturation Voltage
VCE(sat)(2)
IC = 10 mA, IB = 1.0 mA
IC = 50 mA, IB = 5.0 mA
IC = 100 mA, IB = 10 mA
Base-Emitter Saturation Voltage
VBE(sat)(2) IC = 100 mA, IB = 10 mA
(1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
(2) Pulse Test: Pulse Width 300 µs, D.C. 2%.
GreenLine is a trademark of Motorola, Inc. Thermal Clad is a registered trademark of the Berquist Company.
Preferred devices are Motorola recommended choices for future use and best overall value.
100
600
0.1
0.1
0.19
1.1
µA
Vdc
Vdc
REV 1
Motorola Small–Signal Transistors, FETs and Diodes Device Data
© Motorola, Inc. 1995
1
Free Datasheet http://www.datasheet4u.com/

1 Page



MMBT1010LT1 pdf, ピン配列
MMBT1010LT1 MSD1010T1
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a
figure for belt speed. Taken together, these control settings
make up a heating “profile” for that particular circuit board.
On machines controlled by a computer, the computer
remembers these profiles from one operating session to the
next. Figure 8 shows a typical heating profile for use when
soldering a surface mount device to a printed circuit board.
This profile will vary among soldering systems but it is a good
starting point. Factors that can affect the profile include the
type of soldering system in use, density and types of
components on the board, type of solder used, and the type
of board or substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density board.
The Vitronics SMD310 convection/infrared reflow soldering
system was used to generate this profile. The type of solder
used was 62/36/2 Tin Lead Silver with a melting point
between 177 –189°C. When this type of furnace is used for
solder reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
200°C
150°C
100°C
STEP 1
PREHEAT
ZONE 1
“RAMP”
STEP 2
VENT
“SOAK”
STEP 3
HEATING
ZONES 2 & 5
“RAMP”
STEP 4
STEP 5
HEATING HEATING
ZONES 3 & 6 ZONES 4 & 7
“SOAK”
“SPIKE”
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
170°C
150°C
STEP 6 STEP 7
VENT COOLING
205° TO
219°C
PEAK AT
SOLDER
JOINT
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 1. Typical Solder Heating Profile
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different
applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does
not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in
systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of
the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such
unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
Motorola Small–Signal Transistors, FETs and Diodes Device Data
3
Free Datasheet http://www.datasheet4u.com/


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