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S25FL064P の電気的特性と機能

S25FL064PのメーカーはSPANSIONです、この部品の機能は「64-Mbit CMOS 3.0 Volt Flash Memory」です。


製品の詳細 ( Datasheet PDF )

部品番号 S25FL064P
部品説明 64-Mbit CMOS 3.0 Volt Flash Memory
メーカ SPANSION
ロゴ SPANSION ロゴ 




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S25FL064P Datasheet, S25FL064P PDF,ピン配置, 機能
S25FL064P
64-Mbit CMOS 3.0 Volt Flash Memory
with 104-MHz SPI (Serial Peripheral Interface) Multi I/O Bus
Data Sheet
S25FL064P Cover Sheet
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S25FL064P_00
Revision 08
Issue Date January 29, 2013
Free Datasheet http://www.datasheet4u.com/

1 Page





S25FL064P pdf, ピン配列
S25FL064P
64-Mbit CMOS 3.0 Volt Flash Memory
with 104-MHz SPI (Serial Peripheral Interface) Multi I/O Bus
Data Sheet
Distinctive Characteristics
Architectural Advantages
Single power supply operation
– Full voltage range: 2.7 to 3.6V read and write operations
Memory architecture
– Uniform 64 kB sectors
– Top or bottom parameter block (Two 64-kB sectors (top or
bottom) broken down into sixteen 4-kB sub-sectors each)
– 256-byte page size
– Backward compatible with the S25FL064A device
Program
– Page Program (up to 256 bytes) in 1.5 ms (typical)
– Program operations are on a page by page basis
– Accelerated programming mode via 9V W#/ACC pin
– Quad Page Programming
Erase
– Bulk erase function
– Sector erase (SE) command (D8h) for 64 kB sectors
– Sub-sector erase (P4E) command (20h) for 4 kB sectors
– Sub-sector erase (P8E) command (40h) for 8 kB sectors
Cycling endurance
– 100,000 cycles per sector typical
Data retention
– 20 years typical
Device ID
– JEDEC standard two-byte electronic signature
– RES command one-byte electronic signature for backward
compatibility
One time programmable (OTP) area for permanent, secure
identification; can be programmed and locked at the factory
or by the customer
CFI (Common Flash Interface) compliant: allows host system
to identify and accommodate multiple flash devices
Process technology
– Manufactured on 0.09 µm MirrorBit® process technology
Package option
– Industry Standard Pinouts
– 16-pin SO package (300 mils)
– 8-contact WSON package (6 x 8 mm)
– 24-ball BGA package (6 x 8 mm), 5 x 5 pin configuration
– 24-ball BGA package (6 x 8 mm), 6 x 4 pin configuration
Performance Characteristics
Speed
– Normal READ (Serial): 40 MHz clock rate
– FAST_READ (Serial): 104 MHz clock rate (maximum)
– DUAL I/O FAST_READ: 80 MHz clock rate or
20 MB/s effective data rate
– QUAD I/O FAST_READ: 80 MHz clock rate or
40 MB/s effective data rate
Power saving standby mode
– Standby Mode 80 µA (typical)
– Deep Power-Down Mode 3 µA (typical)
Memory Protection Features
Memory protection
– W#/ACC pin works in conjunction with Status Register Bits to
protect specified memory areas
– Status Register Block Protection bits (BP2, BP1, BP0) in status
register configure parts of memory as read-only
Software Features
– SPI Bus Compatible Serial Interface
Publication Number S25FL064P_00
Revision 08
Issue Date January 29, 2013
Free Datasheet http://www.datasheet4u.com/


3Pages


S25FL064P 電子部品, 半導体
Data Sheet
13. Program Acceleration via W#/ACC Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
14. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
14.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
15. Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
16. DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
17. Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
18. AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
18.1 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
19. Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
19.1 SO3 016 — 16-pin Wide Plastic Small Outline Package (300-mil Body Width) . . . . . . . . . . 61
19.2 WNF 008 — WSON 8-contact (6 x 8 mm) No-Lead Package . . . . . . . . . . . . . . . . . . . . . . . . 62
19.3 FAB024 — 24-ball Ball Grid Array (6 x 8 mm) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
19.4 FAC024 — 24-ball Ball Grid Array (6 x 8 mm) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
20. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
6
S25FL064P
S25FL064P_00_08 January 29, 2013
Free Datasheet http://www.datasheet4u.com/

6 Page



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共有リンク

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部品番号部品説明メーカ
S25FL064A

Flash Memory

SPANSION
SPANSION
S25FL064P

64-Mbit 3.0 V SPI Flash Memory

Cypress
Cypress
S25FL064P

64-Mbit CMOS 3.0 Volt Flash Memory

SPANSION
SPANSION


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