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SMP1302-087LF の電気的特性と機能

SMP1302-087LFのメーカーはSkyworks Solutionsです、この部品の機能は「Surface-Mount PIN Diode」です。


製品の詳細 ( Datasheet PDF )

部品番号 SMP1302-087LF
部品説明 Surface-Mount PIN Diode
メーカ Skyworks Solutions
ロゴ Skyworks Solutions ロゴ 




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SMP1302-087LF Datasheet, SMP1302-087LF PDF,ピン配置, 機能
PRELIMINARY DATA SHEET
SMP1302-087LF: Surface-Mount PIN Diode
Applications
Low-loss, high-power switches
Low-distortion attenuators
Features
High RF power handling: 125 W
Low thermal resistance: 22 °C/W
Low series resistance: 1.5 Ω maximum @ 100 mA
Low total capacitance: 0.35 pF maximum @ 30 V
Small QFN (2 x 2 mm) package (MSL1, 260 C per JEDEC J-
STD-020)
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
Description
The SMP1302-087LF is a surface-mountable, low-capacitance
silicon PIN diode designed as a series-connected PIN diode for
high-power, high-volume switch and attenuator applications from
10 MHz to beyond 6 GHz.
Maximum resistance at 100 mA is 1.5 Ω and maximum
capacitance at 30 V is 0.35 pF. The combination of low
capacitance, low parasitic inductance, and nominal 50 μm
I-region width, makes the SMP1302-087LF useful in large signal
switches and attenuator applications.
The device has a 1 W dissipation power rating, which makes it
capable of handling up to 125 W @ 25 °C Continuous Wave (CW)
in a series-connected transmit/receive (T/R) switch.
Design information for high power switches may be found in the
Skyworks Application Note, Design With PIN Diodes (document
number 200312).
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
202942A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 9, 2013
1
Free Datasheet http://www.datasheet4u.com/

1 Page





SMP1302-087LF pdf, ピン配列
PRELIMINARY DATA SHEET • SMP1302-087LF SURFACE-MOUNT PIN DIODE
Electrical and Mechanical Specifications
The absolute maximum ratings of the SMP1302-087LF are
provided in Table 1. Electrical specifications are provided in
Tables 2 and 3.
Typical DC performance characteristics of the SMP1302-087LF
are illustrated in Figures 1, 2, and 3. Typical RF performance of
the SMP1302-087LF using the schematic shown in Figure 4 is
summarized in Table 4 and illustrated in Figures 5, 6, and 7.
The SMP1302-087LF Evaluation Board is used to test the
performance of the SMP1302-087LF PIN Diode. An assembly
drawing for the Evaluation Board is shown in Figure 8. The layer
detail physical characteristics are provided in Figure 9. Refer to
Table 3 for the Evaluation Board Bill of Materials.
Package Dimensions
The PCB layout footprint for the SMP1302-087LF is provided in
Figure 10. Typical case markings are shown in Figure 11.
Typical DC Performance Characteristics
(TA = 25 °C, Unless Otherwise Noted)
Package dimensions for the SMP1302-087LF are provided in
Figure 12, and tape and reel dimensions are provided in
Figure 13.
Package and Handling Information
Instructions on the shipping container label regarding exposure
to moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SMP1302-087LF is rated to Moisture Sensitivity Level 1
(MSL1) at 260 C. It can be used for lead or lead-free soldering.
For additional information, refer to the Skyworks Application
Note, Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
0.40
0.35
0.30
0.25
0.20
0
5
10 15 20
Reverse Voltage (V)
25
30
Figure 1. Capacitance vs Reverse Voltage @ 1 MHz
35
100
10
1
1 10 100
Forward Current (mA)
Figure 2. Series Resistance vs Forward Current @ 100 MHz
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0
10 20 30
Forward Current (mA)
40
Figure 3. Forward Voltage vs Forward Current
50
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
202942A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 9, 2013
3
Free Datasheet http://www.datasheet4u.com/


3Pages


SMP1302-087LF 電子部品, 半導体
PRELIMINARY DATA SHEET • SMP1302-087LF SURFACE-MOUNT PIN DIODE
Cross Section
Name Thickness (in)
Top Soldermask
Material
L1
(0.0028)
Cu foil
Laminate 0.012 ± 0.0006 Rogers RO4003C Core
L2
(0.0014)
Cu foil
Laminate
L3
(Note 1)
(0.0014)
FR4 Prepreg
Cu foil
Laminate 0.010 ± 0.0006
L4 (0.0028)
Bottom Soldermask
Note 1: Adjust this thickness to meet total thickness goal of 0.062 ± 0.005 inches.
FR4 Core
Cu foil
S2531
Figure 9. Board Layer Detail Physical Characteristics
Part Outline
2X 0.80
0.25
0.55
Exposed Soldering
Area, Typical
Pin 1
0.80
Pin 2
0.35
Y0041
Figure 10. SMP1302-087LF PCB Layout Footprint
(Top View)
Pin 1
Indicator
1
Skyworks Part
Marking
2
12
Figure 11. Typical Case Markings
(Top View)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
6 August 9, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202942A
Free Datasheet http://www.datasheet4u.com/

6 Page



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部品番号部品説明メーカ
SMP1302-087LF

Surface-Mount PIN Diode

Skyworks Solutions
Skyworks Solutions


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