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L74VHC1G03 の電気的特性と機能

L74VHC1G03のメーカーはLRCです、この部品の機能は「2-Input NAND Gate」です。


製品の詳細 ( Datasheet PDF )

部品番号 L74VHC1G03
部品説明 2-Input NAND Gate
メーカ LRC
ロゴ LRC ロゴ 




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L74VHC1G03 Datasheet, L74VHC1G03 PDF,ピン配置, 機能
LESHAN RADIO COMPANY, LTD.
2–Input NAND Gate with
Open Drain Output
L74VHC1G03
The L74VHC1G03 is an advanced high speed CMOS 2–input NOR gate with an open drain output fabricated with silicon gate
CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power
dissipation.
The internal circuit is composed of three stages, including an open drain output which provides the capability to set output switching
level. This allows the L74VHC1G03 to be used to interface 5 V circuits to circuits of any voltage between V CC and 7 V using an external
resistor and power supply.
The L74VHC1G03 input structure provides protection when voltages up to 7 V are applied, regardless of the supply voltage.
• High Speed: t PD = 3.6 ns (Typ) at V CC = 5 V
• Low Internal Power Dissipation: I CC = 2 mA (Max) at T A = 25°C
• Power Down Protection Provided on Inputs
• Pin and Function Compatible with Other Standard Logic Families
• Chip Complexity: FETs = 62; Equivalent Gates = 16
5
4
MARKING DIAGRAMS
1
2
3
SC–88A / SOT–353/SC–70
DF SUFFIX
5
4
VPd
Pin 1
d = Date Code
Figure 1. Pinout (Top View)
1
2
3
TSOP–5/SOT–23/SC–59
DT SUFFIX
VPd
Pin 1
d = Date Code
Figure 2. Logic Symbol
PIN ASSIGNMENT
1 IN B
2 IN A
3 GND
4 OUT Y
5 V CC
www.DataSheet4U.com
FUNCTION TABLE
Inputs
A
L
L
H
H
B
L
H
L
H
Output
Y
Z
L
L
L
ORDERING INFORMATION
See detailed ordering and shipping information in the
package dimensions section on page 5 of this data sheet.
1/6

1 Page





L74VHC1G03 pdf, ピン配列
LESHAN RADIO COMPANY, LTD.
DC ELECTRICAL CHARACTERISTICS
Symbol
V IH
Parameter
Minimum High–Level
Input Voltage
Test Conditions
V IL Maximum Low–Level
Input Voltage
V OH
Minimum High–Level
Output Voltage
V IN = V IH or V IL
V OL Maximum Low–Level
Output Voltage
V IN = V IH or V IL
I IN
I CC
I OPD
Maximum Input
Leakage Current
Maximum Quiescent
Supply Current
Maximum Off–state
Leakage Current
V IN = V IH or V IL
I OH = – 50 µA
V IN = V IH or V IL
I OH = –4 mA
I OH = –8 mA
V IN = V IH or V IL
I OL = 50 µA
V IN = V IH or V IL
I OL = 4 mA
I OL = 8 mA
V IN = 5.5 V or GND
V IN = V CC or GND
V OUT = 5.5 V
L74VHC1G03
V CC T A = 25°C T A < 85°C –55°C<TA<125°C
(V) Min Typ Max Min Max Min Max Unit
2.0 1.5
1.5 1.5
V
3.0 2.1
2.1 2.1
4.5 3.15
3.15 3.15
5.5 3.85
3.85 3.85
2.0 0.5 0.5 0.5 V
3.0 0.9 0.9 0.9
4.5 1.35 1.35 1.35
5.5 1.65 1.65 1.65
2.0 1.9 2.0
1.9 1.9
V
3.0 2.9 3.0
2.9 2.9
4.5 4.4 4.0
4.4 4.4
3.0 2.58
4.5 3.94
2.0 0.0
3.0 0.0
4.5 0.0
2.48 2.34
3.80 3.66
0.1 0.1 0.1
0.1 0.1 0.1
0.1 0.1 0.1
V
3.0
4.5
0 to5.5
0.36
0.36
±0.1
0.44
0.44
±1.0
0.52
0.52
±1.0
µA
5.5 2.0 20 40 µA
0
0.25 2.5
5.0 µA
AC ELECTRICAL CHARACTERISTICS C load = 50 pF, Input t r = t f = 3.0 ns
Symbol Parameter
t PZL Maximum Output
Enable Time,
Input A or B to Y
t PLZ Maximum Output
Disable Time
C IN Maximum Input
Capacitance
Test Conditions
V CC = 3.3 ± 0.3 V C L = 15 pF
R L = R I = 500 C L = 50 pF
V CC = 5.0 ± 0.5 V C L = 15 pF
R L = R I = 500 C L = 50 pF
V CC = 3.3 ± 0.3 V C L = 50 pF
R L = R I = 500
V CC = 5.0 ± 0.5 V C L = 50 pF
R L = R I = 500
T A = 25°C
T A < 85°C –55°C to 125°C
Min Typ Max Min Max Min Max Unit
5.6 7.9
9.5 11.0 ns
8.1 11.4
13.0 15.5
3.6 5.5
5.1 7.5
8.1 11.4
6.5 8.0
8.5 10.0
13.0 15.5 ns
5.1 7.5
8.5 10.0
4 10
10 10 pF
C PD Power Dissipation Capacitance (Note 6)
Typical @ 25°C, V CC = 5.0 V
18
pF
6. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without
x x .load. Average operating current can be obtained by the equation: I CC(OPR) = C PD V CC f in + I CC C PD is used to determine the no–
x x xload dynamic power consumption; P D = C PD V CC 2 f in + I CC V CC .
3/6


3Pages


L74VHC1G03 電子部品, 半導体
LESHAN RADIO COMPANY, LTD.
D
54
S 1 23
L
G
A
B
0.05 (0.002)
H
C
L74VHC1G03
PACKAGE DIMENSIONS
SOT23−5/TSOP−5/SC59−5
DT SUFFIX
J
KM
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. A AND B DIMENSIONS DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
MILLIMETERS
DIM MIN MAX
A 2.90 3.10
B 1.30 1.70
C 0.90 1.10
D 0.25 0.50
G 0.85 1.05
H 0.013 0.100
J 0.10 0.26
K 0.20 0.60
L 1.25 1.55
M 0 _ 10_
S 2.50 3.00
INCHES
MIN MAX
0.1142 0.1220
0.0512 0.0669
0.0354 0.0433
0.0098 0.0197
0.0335 0.0413
0.0005 0.0040
0.0040 0.0102
0.0079 0.0236
0.0493 0.0610
0_ 10_
0.0985 0.1181
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
1.0
0.039
2.4
0.094
0.7
0.028
ǒ ǓSCALE 10:1
mm
inches
6/6

6 Page



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