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TLP2095 の電気的特性と機能

TLP2095のメーカーはToshiba Semiconductorです、この部品の機能は「PHOTOCOUPLER」です。


製品の詳細 ( Datasheet PDF )

部品番号 TLP2095
部品説明 PHOTOCOUPLER
メーカ Toshiba Semiconductor
ロゴ Toshiba Semiconductor ロゴ 




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TLP2095 Datasheet, TLP2095 PDF,ピン配置, 機能
TLP2095
TOSHIBA PHOTOCOUPLER GaAAs IRED & PHOTO-IC
TLP2095
www.DataSheet4U.com
Programmable logic controllers
High-speed line receivers
Microprocessor system interfaces
Unit in mm
The Toshiba TLP2095 consists of two GaAAs light emitting diodes
optically coupled to a high-gain, high-speed photodetector.
The TLP2095 is housed in a 6-pin MFSOP.
With a totem-pole output, the TLP2095 is capable of both sinking and
sourcing current.
The TLP2095 has an internal Faraday shield, which provides a
guaranteed common-mode transient immunity of ±10 kV/μs.
The TLP2095 has a noninverting output. An inverting-output version, the
TLP2098, is also available.
z Buffer logic type (totem-pole output)
z Guaranteed Performance Over Temperature: -40 to 100°C
z Power Supply Voltage: 3.0 to 20 V
JEDEC
JEITA
TOSHIBA
11-4C2
Weight: 0.09 g (typ.)
Pin Configuration (top view)
z Input Threshold Current: IFLH =±3 mA (max)
z Switching Time (tpLH/tpHL): 250 ns (max)
z Common mode transient immunity: ±10 kV/μs
z Isolation Voltage: 3750 Vrms
Truth Table
1 VCC 6 1 : Anode
Cathode
5
3 : Cathode
Anode
3
GND
SHIELD
4
4 : GND
5 : Output
6 : VCC
Input
H
L
LED
ON
OFF
Tr1
ON
OFF
Tr2
OFF
ON
Output
H
L
Schematic
ICC
IF1
1
VF
3
IF2
6 VCC
Tr1
IO
Tr2 5 VO
SHIELD
GND
4
0.1 μF bypass capacitor must be
connected between pin 6 and 4
1 2009-08-11

1 Page





TLP2095 pdf, ピン配列
TLP2095
Electrical Characteristics
www.DataSheet4U.com
(Unless otherwise specified, Ta = -40 to 100°C, VCC = 3.0 to 20 V)
CHARACTERISTIC
TEST
SYMBOL CIRCUIT
CONDITION
MIN
TYP.
MAX
UNIT
Input Forward Voltage
VF IF = 10 mA , Ta = 25°C
1.45 1.57 1.75 V
Temperature Coefficient
of Forward Voltage
ΔVF/ΔTa
IF = 10 mA
-2.0 mV/°C
Input Capacitance
CT V=0, f=1 MHz , Ta=25°C
190 - pF
Logic Low Output Voltage
VOL
1 IOL = 0.02 mA, VF=0.8 V
0.2 0.6 V
Logic High Output Voltage
VOH
2
IOH = -0.02 mA,
IF = 5 mA
VCC-1.0 VCC-0.7
V
Logic Low Supply Current
ICCL
3 VF=0 V
― ― 3.0 mA
Logic High Supply Current
ICCH
4 IF=5 mA
― ― 3.0 mA
Logic Low Short Circuit
Output Current (Note4)
Logic High Short Circuit
Output Current (Note4)
IOSL
IOSH
5 VF=0 V
6 IF=5 mA
VO=GND
VCC=VO=4.5 V
VCC=VO=20 V
VCC=4.5 V
VCC=20 V
15
20
-5
-10
80
90
-15
-20
mA
mA
Input Current Logic High
Output
IFLH
IO=-0.02 mA, VO>2.4 V
1.0 3.0 mA
Input Voltage Logic Low
Output
VFHL
IO=0.02 mA, VO<0.4 V
Input Current Hysteresis
IHYS
VCC=5 V
*All typical values are at VCC=5V, Ta=25°C
Note 4: Duration of output short circuit time should not exceed 10 ms.
0.8
0.05
V
mA
Isolation Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
MIN TYP. MAX Unit
Capacitance input to output
Isolation resistance
CS VS = 0, f = 1 MHz
(Note 2) 0.8 pF
RS
R.H. 60%,VS = 500 V (Note 2) 1×1012 1014
Ω
Isolation voltage
BVS
AC,1 minute
AC,1 second,in oil
DC,1 minute,in oil
3750
10000
10000
Vrms
Vdc
Note 4: A ceramic capacitor (0.1 μA) should be connected from pin 6 to pin 4 to stabilize the operation of the high
gain linear amplifier. Failure to provide the bypassing may impair the switching property. The total lead
length between capacitor and coupler should not exceed 1 cm.
3 2009-08-11


3Pages


TLP2095 電子部品, 半導体
Soldering and Storage
TLP2095
www.DataSheet4U.com
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
much as possible by observing the following conditions.
1) Using solder reflow
·Temperature profile example of lead (Pb) solder
(°C)
240
210
160
140
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste type
used by the customer within the
described profile.
60 to 120s
less than 30s
Time
(s)
·Temperature profile example of using lead (Pb)-free solder
(°C)
260
230
190
180
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste type
used by the customer within the
described profile.
60 to 120s
30 to 50s
Time
(s)
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
Please preheat it at 150°C between 60 and 120 seconds.
Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may
be heated at most once.
6 2009-08-11

6 Page



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共有リンク

Link :


部品番号部品説明メーカ
TLP2095

PHOTOCOUPLER

Toshiba Semiconductor
Toshiba Semiconductor
TLP2098

PHOTOCOUPLER

Toshiba Semiconductor
Toshiba Semiconductor
TLP209D

PHOTO RELAY

Toshiba Semiconductor
Toshiba Semiconductor


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