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PDF VLMS310 Data sheet ( Hoja de datos )
| Número de pieza | VLMS310 | |
| Descripción | Standard SMD LED PLCC-2 | |
| Fabricantes | Vishay Siliconix | |
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VLMS310.
Vishay Semiconductors
Standard SMD LED PLCC-2
94 8553
DESCRIPTION
This device has been designed for applications
requiring narrow brightness and color selection.
The package of this device is the PLCC-2.
It consists of a lead frame which is embedded in a
www.DatwaShhiteeett4hUe.rcmomoplast. The reflector inside this package is
filled up with clear epoxy.
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
• Package: SMD PLCC-2
• Product series: standard
• Angle of half intensity: ± 60°
FEATURES
• Lead (Pb)-free product - RoHS compliant
• SMD LED with exceptional brightness
• Luminous intensity categorized
• Compatible with automatic placement
equipment
e3
• EIA and ICE standard package
• Compatible with infrared, vapor phase and wave
solder processes according to CECC
• Available in 8 mm tape
• Low profile package
• Non-diffused lens: excellent for coupling to light
pipes and backlighting
• Low power consumption
• Luminous intensity ratio in one packaging unit
IVmax/IVmin ≤ 1.6
• Lead (Pb)-free device
• preconditioning: acc. to JEDEC level 2a
• ESD-withstand voltage:
up to 1 kV according to JESD22-A114-B
APPLICATIONS
• Automotive: backlighting in dashboards and
switches
• Telecommunication: indicator and backlighting in
telephone and fax
• Indicator and backlight for audio and video
equipment
• Indicator and backlight in office equipment
• Flat backlight for LCDs, switches and symbols
• General use
PARTS TABLE
PART
VLMS3100-GS08
VLMS3100-GS18
VLMS3101-GS08
VLMS3101-GS18
COLOR, LUMINOUS INTENSITY
Red, IV > 2.8 mcd
Red, IV > 2.8 mcd
Red, IV = (4.5 to 11.2) mcd
Red, IV = (4.5 to 11.2) mcd
TECHNOLOGY
GaAsP on GaP
GaAsP on GaP
GaAsP on GaP
GaAsP on GaP
Document Number 81214
Rev. 1.1, 30-Aug-07
www.vishay.com
1
1 page  
VLMS310.
Vishay Semiconductors
METHOD OF TAPING/POLARITY AND TAPE AND REEL
SMD LED (VLM.3 - SERIES)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with
DIN IEC 40 (CO) 564) for automatic component
insertation. The blister tape is a plastic strip with
impressed component cavaties, covered by a top tape.
Adhesive Tape
Blister Tape
Component Cavity
94 8670
REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS18
(= 8000 PCS.) PREFERRED
120°
10.4
8.4
Identification
Label:
Vishay
Type
Group
Tape Code
Production
Code
Quantity
4.5
3.5
2.5
1.5
13.00
12.75
62.5
60.0
321 14.4 max.
329
18857
Figure 12. Reel dimensions - GS18
TAPING OF VLM.3...
3.5
3.1
2.2
2.0
5.75
5.25
3.6 8.3
3.4 7.7
4.0
3.6
1.85
1.65
1.6 4.1
1.4 3.9
4.1
3.9
0.25
2.05
1.95
94 8668
Figure 10. Tape dimensions in mm for PLCC-2
www.DataSheet4U.com
REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS08
(= 1500 PCS.)
120°
10.0
9.0
Identification
Label:
Vishay
Type
Group
Tape Code
Production
Code
Quantity
4.5
3.5
2.5
1.5
13.00
12.75
63.5
60.5
180 14.4 max.
178
94 8665
Figure 11. Reel dimensions - GS08
SOLDERING PROFILE
IR Reflow Soldering Profile for lead (Pb)-free soldering
Preconditioning acc. to JEDEC Level 2a
300
250
225555°C°C
240 °C
217 °C
200
150
100
max. 120 sec
max. 260 °C
245 °C
max. 30 s
max. 100 sec
max. Ramp Up 3 °C/sec
50
max. Ramp Down 6 °C/sec
0
0 50 100 150 200 250 300
19470-2
Time (s)
max. 2 cycles allowed
Figure 13. Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020C)
TTW Soldering (acc. to CECC00802)
948626-1
300
5s
Lead Temperature
250
235 °C...260 °C
first wave
200
second
wave
full line: typical
dotted line: process limits
ca. 2 K/s
ca. 200 K/s
150
100 °C...130 °C
100
2 K/s
50
ca. 5 K/s
forced cooling
0
0 50 100 150 200 250
Time (s)
Figure 14. Double wave soldering of opto devices (all packages)
Document Number 81214
Rev. 1.1, 30-Aug-07
www.vishay.com
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet VLMS310.PDF ] | |
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