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Número de pieza | SIGC12T60NC | |
Descripción | IGBT Chip | |
Fabricantes | Infineon Technologies | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de SIGC12T60NC (archivo pdf) en la parte inferior de esta página. Total 4 Páginas | ||
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IGBT Chip in NPT-technology
FEATURES:
• 600V NPT technology
• 100µm chip
• positive temperature coefficient
• easy paralleling
Preliminary
SIGC12T60NC
This chip is used for:
• IGBT Modules
Applications:
• drives
C
G
E
Chip Type
SIGC12T60NC
VCE
ICn
Die Size
600V 10A
3.5 x 3.5 mm2
Package Ordering Code
sawn on foil
Q67041-A4688-
A001
MECHANICAL PARAMETER:
Raster size
Area total / active
Emitter pad size
Gate pad size
Thickness
Wafer size
Flat position
Max.possible chips per wafer
Passivation frontside
Emitter metallization
Collector metallization
Die bond
Wire bond
Reject Ink Dot Size
Recommended Storage Environment
3.5 x 3.5
mm2
12.25 / 8.7
1.989 x 1.583
1.1 x 0.694
100 µm
150 mm
0 deg
1219
Photoimide
3200 nm Al Si 1%
1400 nm Ni Ag –system
suitable for epoxy and soft solder die bonding
electrically conductive glue or solder
Al, ≤500µm
∅ 0.65mm ; max 1.2mm
store in original container, in dry nitrogen,
< 6 month at an ambient temperature of 23°C
Edited by INFINEON Technologies AI PS DD HV3, L 7222-M, Edition 2, 20.03.2003
1 page |
Páginas | Total 4 Páginas | |
PDF Descargar | [ Datasheet SIGC12T60NC.PDF ] |
Número de pieza | Descripción | Fabricantes |
SIGC12T60NC | IGBT Chip | Infineon Technologies |
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