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908E625 の電気的特性と機能

908E625のメーカーはFreescale Semiconductorです、この部品の機能は「Integrated Quad Half H-Bridge」です。


製品の詳細 ( Datasheet PDF )

部品番号 908E625
部品説明 Integrated Quad Half H-Bridge
メーカ Freescale Semiconductor
ロゴ Freescale Semiconductor ロゴ 




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908E625 Datasheet, 908E625 PDF,ピン配置, 機能
Freescale Semiconductor
Technical Data
MM908E625
Rev 4.0, 09/2005
Integrated Quad Half H-Bridge
with Power Supply, Embedded
MCU, and LIN Serial
Communication
The 908E625 is an integrated single-package solution including a
high-performance HC08 microcontroller with a SMARTMOSTM
analog control IC. The HC08 includes Flash Memory, a timer,
Enhanced Serial Communications Interface (ESCI), an Analog-to-
Digital Converter (ADC), Serial Peripheral Interface (SPI) (only
internal), and an Internal Clock Generator (ICG) module. The analog
control die provides fully protected H-Bridge/high-side outputs,
voltage regulator, autonomous watchdog with cyclic wake-up, and
Local Interconnect Network (LIN) physical layer.
The single-package solution, together with LIN, provides optimal
application performance adjustments and space-saving PCB design.
It is well suited for the control of automotive mirror, door lock, and
light-levelling applications.
908E625
H-BRIDGE POWER SUPPLY WITH
EMBEDDED MCU AND LIN
DWB SUFFIX
98ARL105910
54-TERMINAL SOICWB-EP
Features
www.DataSheet4U.com
• High-Performance M68HC908EY16 Core
• 16 K Bytes of On-Chip Flash Memory
• 512 Bytes of RAM
• Internal Clock Generation Module
• Two 16-bit, 2-Channel Timers
• 10-Bit Analog-to-Digital Converter
• LIN Physical Layer
• Autonomous Watchdog with Cyclic Wakeup
• Three Two-Terminal Hall-Effect Sensor Input Ports
• One Analog Input with Switchable Current Source
• Four Low RDS(ON) Half-Bridge Outputs
• One Low RDS(ON) High-Side Output
• 13 Micro Controller I/Os
LIN
VREFH
VDDA
EVDD
VDD
3 908E625
VSUP
VREFL
VSSA
EVSS
VSS
RST
RST_A
IRQ
IRQ_A
SS
PTB1/AD1
RXD
PTE1/RXD
PTD1/TACH1
FGEN
BEMF
PTD0/TACH0/BEMF
GND EP
2
ORDERING INFORMATION
Device
MM908E625ACDWB
Temperature
Range (TA)
-40°C to 85°C
Package
54 SOICW
EP
HB1
HB2
HB3
HB4
HS
HVDD
H1
H2
H3
PA1
Port A I/Os
Port B I/Os
Port C I/Os
M
M
M
4 Half-Bridges
Controlling
3 Loads
High-Side
Output
Switchable Internal
VDD Output
Three
2-Terminal Hall-Effect
Sensor Inputs
Analog Input with
Current Source
Microcontroller
Ports
Figure 1. 908E625 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2005. All rights reserved.

1 Page





908E625 pdf, ピン配列
TERMINAL CONNECTIONS
TERMINAL CONNECTIONS
PTB7/AD7/TBCH1
PTB6/AD6/TBCH0
PTC4 /OSC1
PTC3 /OSC2
PTC2 / MCLK
PTB5 /AD5
PTB4 /AD4
PTB3 /AD3
IRQ
RST
PTB1/AD1
PTD0 / TACH0 / BEMF
PTD1/TACH1
NC
FGEN
BEMF
RST_A
IRQ_A
SS
LIN
NC
NC
HB1
VSUP1
GND1
HB2
VSUP2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
Exposed
Pad
54 PTA0/KBD0
53 PTA1/KBD1
52 PTA2/KBD2
51 FLSVPP
50 PTA3/KBD3
49 PTA4/KBD4
48 VREFH
47 VDDA
46 EVDD
45 EVSS
44 VSSA
43 VREFL
42 PTE1/RXD
41 RXD
40 VSS
39 PA1
38 VDD
37 H1
36 H2
35 H3
34 HVDD
33 NC
32 HB4
31 VSUP3
30 GND2
29 HB3
28 HS
Figure 3. 908E625 Terminal Connections (Transparent Package Top View)
Table 1. 908E625 Terminal Definitions
A functional description of each terminal can be found in the Functional Terminal Description section beginning on page 15.
Terminal
Function
Terminal
Terminal Name
Formal Name
Definition
MCU
1
PTB7/AD7/TBCH1
Port B I/Os
These terminals are special-function, bidirectional I/O port
2 PTB6/AD6/TBCH0
terminals that are shared with other functional modules in the
6 PTB5/AD5
MCU.
7 PTB4/AD4
8 PTB3/AD3
11 PTB1/AD1
MCU
MCU
MCU
MCU
3
PTC4/OSC1
Port C I/Os
These terminals are special-function, bidirectional I/O port
4 PTC3/OSC2
terminals that are shared with other functional modules in the
5 PTC2/MCLK
MCU.
9 IRQ External Interrupt Input This terminal is an asynchronous external interrupt input
terminal.
10
RST
External Reset
This terminal is bidirectional, allowing a reset of the entire
system. It is driven low when any internal reset source is
asserted.
12
PTD0/TACH0/BEMF
Port D I/Os
These terminals are special-function, bidirectional I/O port
13 PTD1/TACH1
terminals that are shared with other functional modules in the
MCU.
14, 21, 22, 33
NC
No Connect
Not connected.
Analog Integrated Circuit Device Data
Freescale Semiconductor
908E625
3


3Pages


908E625 電子部品, 半導体
MAXIMUM RATINGS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Supply Voltage
Analog Chip Supply Voltage under Normal Operation, Steady State
Analog Chip Supply Voltage under Transient Conditions (1)
Microcontroller Chip Supply Voltage
VSUP(SS)
VSUP(PK)
VDD
-0.3 to 28
-0.3 to 40
-0.3 to 6.0
V
Input Terminal Voltage
Analog Chip
Microcontroller Chip
Maximum Microcontroller Current per Terminal
All Terminals Except VDD, VSS, PTA0:PTA6, PTC0:PTC1
Terminals PTA0:PTA6, PTC0:PTC1
Maximum Microcontroller VSS Output Current
Maximum Microcontroller VDD Input Current
LIN Supply Voltage
Normal Operation (Steady-State)
Transient Conditions (1)
ESD Voltage
Human Body Model (HBM)(2)
Machine Model (MM)(3)
Charge Device Model (CDM)(4)
VIN (ANALOG)
VIN (MCU)
-0.3 to 5.5
VSS-0.3 to VDD+0.3
IPIN(1)
IPIN(2)
IMVSS
IMVDD
±15
± 25
100
100
VBUS(SS)
VBUS(DYNAMIC)
VESD
-18 to 28
40
± 3000
± 150
± 500
V
mA
mA
mA
V
V
THERMAL RATINGS
Storage Temperature
Ambient Operating Temperature
Operating Case Temperature (5)
TSTG
TA
TC
-40 to 150
-40 to 85
-40 to 85
°C
°C
°C
Operating Junction Temperature(6)
TJ
-40 to 125
°C
Peak Package Reflow Temperature During Solder Mounting (7)
TSOLDER
245
°C
Notes
1. Transient capability for pulses with a time of t < 0.5 sec.
2. ESD voltage testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 )
3. ESD voltage testing is performed in accordance with the Machine Model (CZAP =200 pF, RZAP = 0 )
4. ESD voltage testing is performed in accordance with Charge Device Model, robotic (CZAP =4.0 pF).
5. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
6. The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150°C under these conditions.
7. Terminal soldering temperature is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
908E625
6
Analog Integrated Circuit Device Data
Freescale Semiconductor

6 Page



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