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PDF STPS30100ST Data sheet ( Hoja de datos )

Número de pieza STPS30100ST
Descripción Power Schottky Rectifier
Fabricantes ST Microelectronics 
Logotipo ST Microelectronics Logotipo



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STPS30100ST
Power Schottky rectifier
Main product characteristics
A
IF(AV)
VRRM
Tj (max)
VF(typ)
30 A
100 V
150° C
0.385 V
Features and Benefits
Avalanche rated
Low VF
Good trade off between leakage current and
forward voltage drop
High frequency operation
Avalanche capability specified
Description
Single Schottky rectifier, suited for high frequency
switch mode power supply.
Packaged in TO-220AB, this device is intended to
be used in notebook and game station adaptors,
providing in these applications a good efficiency
at both low and high load.
K
A
K
A
AK
TO-220AB
STPS30100ST
Table 1. Absolute Ratings (limiting values)
Symbol
Parameter
VRRM Repetitive peak reverse voltage
IF(RMS) RMS forward current
IF(AV) Average forward current δ = 0.5
Tc = 125° C
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
PARM Repetitive peak avalanche power
tp = 1 µs Tj = 25° C
Tstg Storage temperature range
Tj Maximum operating junction temperature (1)
1.
d----P-----t--o----t
dTj
<
R-----t--h----(-1--j-------a----)
condition to avoid thermal runaway for a diode on its own heatsink
Value
100
60
30
300
26400
-65 to + 175
150
Unit
V
A
A
A
W
°C
°C
October 2006
Rev 1
1/7
www.st.com
7

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STPS30100ST pdf
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STPS30100ST
2 Package Information
Package Information
Epoxy meets UL94,V0
Table 4. TO-220AB dimensions
Dimensions
Ref. Millimeters
Inches
I4
l3
l2
B
ØI
L
A
a1
a2
b1
e
Min. Typ. Max. Min. Typ. Max.
C
b2
F
c2
M
c1
A 15.20
15.90 0.598
0.625
a1 3.75
0.147
a2 13.00
14.00 0.511
0.551
B 10.00
10.40 0.393
0.409
b1 0.61
0.88 0.024
0.034
b2 1.23
1.32 0.048
0.051
C 4.40
4.60 0.173
0.181
c1 0.49
0.70 0.019
0.027
c2 2.40
2.72 0.094
0.107
e 2.40
2.70 0.094
0.106
F 6.20
6.60 0.244
0.259
ØI 3.75
3.85 0.147
0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65
2.95 0.104
0.116
l2 1.14
1.70 0.044
0.066
l3 1.14
1.70 0.044
0.066
M 2.60
0.102
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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