GS816136B Datasheet PDF - GSI
| Part Number | GS816136B | |
| Description | (GS816118B - GS816136B) Sync Burst SRAMs | |
| Manufacturers | GSI | |
| Logo |  |
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GS816118B(T/D)/GS816132B(D)/GS816136B(T/D)
100-Pin TQFP & 165-Bump BGA 1M x 18, 512K x 32, 512K x 36
Commercial Temp
Industrial Temp
18Mb Sync Burst SRAMs
250 MHz–150 MHz
2.5 V or 3.3 V VDD
2.5 V or 3.3 V I/O
Features
• FT pin for user-configurable flow through or pipeline
operation
• Single Cycle Deselect (SCD) operation
• IEEE 1149.1 JTAG-compatible Boundary Scan
• 2.5 V or 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC-standard 100-lead TQFP 100-pin TQFP and 165-bump
BGA packages
• RoHS-compliant 100-pin TQFP and 165-bump BGA packages
available
either linear or interleave order with the Linear Burst Order (LBO)
input. The Burst function need not be used. New addresses can be
loaded on every cycle with no degradation of chip performance.
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by the
user via the FT mode pin (Pin 14). Holding the FT mode pin low
places the RAM in Flow Through mode, causing output data to
bypass the Data Output Register. Holding FT high places the
RAM in Pipeline mode, activating the rising-edge-triggered Data
Output Register.
SCD Pipelined Reads
The GS816118B(T/D)/GS816132B(D)/GS816136B(T/D) is a
SCD (Single Cycle Deselect) pipelined synchronous SRAM. DCD
(Dual Cycle Deselect) versions are also available. SCD SRAMs
pipeline deselect commands one stage less than read commands.
SCD RAMs begin turning off their outputs immediately after the
deselect command has been captured in the input registers.
Functional Description
Applications
The GS816118B(T/D)/GS816132B(D)/GS816136B(T/D) is an
18,874,368-bit high performance synchronous SRAM with a 2-bit
burst address counter. Although of a type originally developed for
Level 2 Cache applications supporting high performance CPUs,
the device now finds application in synchronous SRAM
applications, ranging from DSP main store to networking chip set
support.
Controls
Addresses, data I/Os, chip enable (E1), address burst control
inputs (ADSP, ADSC, ADV) and write control inputs (Bx, BW,
GW) are synchronous and are controlled by a positive-edge-
triggered clock input (CK). Output enable (G) and power down
control (ZZ) are asynchronous inputs. Burst cycles can be initiated
with either ADSP or ADSC inputs. In Burst mode, subsequent
burst addresses are generated internally and are controlled by
ADV. The burst address counter may be configured to count in
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write control
inputs.
Sleep Mode
Low power (Sleep mode) is attained through the assertion (High)
of the ZZ signal, or by stopping the clock (CK). Memory data is
retained during Sleep mode.
Core and Interface Voltages
The GS816118B(T/D)/GS816132B(D)/GS816136B(T/D)
operates on a 2.5 V or 3.3 V power supply. All input are 3.3 V and
2.5 V compatible. Separate output power (VDDQ) pins are used to
decouple output noise from the internal circuits and are 3.3 V and
2.5 V compatible.
Parameter Synopsis
-250 -200 -150 Unit
Pipeline
3-1-1-1
tKQ
tCycle
Curr (x18)
Curr (x32/x36)
2.5 3.0 3.8 ns
4.0 5.0 6.7 ns
295 245 200 mA
345 285 225 mA
Flow Through
2-1-1-1
tKQ
tCycle
Curr (x18)
Curr (x32/x36)
5.5 6.5 7.5 ns
5.5 6.5 7.5 ns
225 200 185 mA
255 220 205 mA
Rev: 1.03 9/2005
1/35
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
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GS816118B(T/D)/GS816132B(D)/GS816136B(T/D)
165 Bump BGA—x18 Commom I/O—Top View (Package D)
1 2 3 4 5 6 7 8 9 10 11
A NC A E1 BB NC E3 BW ADSC ADV A A
A
B NC A E2 NC BA CK GW G ADSP A NC B
C NC NC VDDQ VSS VSS VSS VSS VSS VDDQ NC DQPA C
D
NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA
D
E
NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA
E
F
NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA
F
G
NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA
G
H FT MCL NC VDD VSS VSS VSS VDD NC NC ZZ H
J DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC
J
K DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC
K
L DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC
L
M DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC
M
N
DQPB NC VDDQ VSS
NC
A
NC VSS VDDQ NC NC
N
P
NC NC
A
A TDI A1 TDO A
A
A
A
P
R LBO NC A A TMS A0 TCK A A A A
R
11 x 15 Bump BGA—13mm x 15 mm Body—1.0 mm Bump Pitch
Rev: 1.03 9/2005
5/35
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology
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| Information | Total 35 Pages | |
| Link URL | [ Copy URL to Clipboard ] | |
| Download | [ GS816136B.PDF Datasheet ] | |
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