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S29AL016M の電気的特性と機能

S29AL016MのメーカーはSPANSIONです、この部品の機能は「16 MEGABIT (2M X 8 BIT / I M X 16 BIT) 3.0 VOLT ONLY BOOT SECTOR FLASH MEMORY」です。


製品の詳細 ( Datasheet PDF )

部品番号 S29AL016M
部品説明 16 MEGABIT (2M X 8 BIT / I M X 16 BIT) 3.0 VOLT ONLY BOOT SECTOR FLASH MEMORY
メーカ SPANSION
ロゴ SPANSION ロゴ 




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S29AL016M Datasheet, S29AL016M PDF,ピン配置, 機能
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S29AL016M
16 Megabit (2 M x 8-Bit/1 M x 16-Bit)
3.0 Volt-only Boot Sector Flash Memory
featuring MirrorBitTM technology
Data Sheet
Distinctive Characteristics
DATASHEET
Architectural Advantages
„ Single power supply operation
— 3 V for read, erase, and program operations
„ Manufactured on 0.23 µm MirrorBitTM process
technology
— 400 nA standby mode current
— 15 mA read current
— 40 mA program/erase current
— 400 nA Automatic Sleep mode current
„ Package options
„ SecSiTM (Secured Silicon) Sector region
— 48-ball Fine-pitch BGA
— 128-word/256-byte sector for permanent, secure
identification through an 8-word/16-byte random
Electronic Serial Number, accessible through a
— 64-ball Fortified BGA
— 48-pin TSOP
command sequence
— May be programmed and locked at the factory or by
the customer
„ Flexible sector architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and thirty-
one 64 Kbyte sectors (byte mode)
— One 8 Kword, two 4 Kword, one 16 Kword, and thirty-
one 32 Kword sectors (word mode)
Software Features
— Program Suspend & Resume: read other sectors
before programming operation is completed
— Erase Suspend & Resume: read/program other
sectors before an erase operation is completed
— Data# polling & toggle bits provide status
— Unlock Bypass Program command reduces overall
multiple-word programming time
„ Compatibility with JEDEC standards
— CFI (Common Flash Interface) compliant: allows host
Provides pinout and
power supply flash,
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to
identify
and
accommodate
multiple
flash
protection
„ Top or bottom boot block configurations available
„ 100,000 erase cycle typical per sector
„ 20-year typical data retention
Performance Characteristics
Hardware Features
— Sector Protection: hardware-level method of
preventing write operations within a sector
— Temporary Sector Unprotect: VID-level method of
changing code in locked sectors
— Hardware reset input (RESET#) resets device
„ High performance
— Ready/Busy# output (RY/BY#) indicates program or
— 90 ns access time
erase cycle completion
— 0.7 s typical sector erase time
„ Low power consumption (typical values at 5 MHz)
DataShee
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Publication Number S29AL016M_00 Revision A Amendment 4 Issue Date April 21, 2004
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S29AL016M pdf, ピン配列
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Table of Contents
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S29AL016M 2
General Description 3
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 5. Erase Operation .................................................. 30
Program Suspend/Program Resume Command Sequence ...... 30
Figure 6. Program Suspend/Program Resume ....................... 31
Command Definitions Tables ........................................................... 32
Command Definitions (x16 Mode, BYTE# = VIH).................... 32
Command Definitions (x8 Mode, BYTE# = VIL)...................... 33
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 34
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
DQ7: Data# Polling .............................................................................. 34
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 10
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 11
Table 1. S29AL016M Device Bus Operations .........................11
Word/Byte Configuration .................................................................... 11
Figure 7. Data# Polling Algorithm ....................................... 35
RY/BY#: Ready/Busy# ..........................................................................35
DQ6: Toggle Bit I .................................................................................. 36
DQ2: Toggle Bit II ................................................................................ 36
Requirements for Reading Array Data ............................................ 11
Reading Toggle Bits DQ6/DQ2 .........................................................37
Writing Commands/Command Sequences ................................... 12
Program and Erase Operation Status .............................................. 12
Standby Mode ......................................................................................... 12
Figure 8. Toggle Bit Algorithm ............................................ 38
DQ5: Exceeded Timing Limits .......................................................... 38
DQ3: Sector Erase Timer .................................................................. 39
Automatic Sleep Mode ......................................................................... 13
RESET#: Hardware Reset Pin ............................................................ 13
Output Disable Mode ........................................................................... 13
Table 2. Sector Address Tables (Model 01, Top Boot Device) ...14
Table 3. Sector Address Tables (Model 02, Bottom Boot Device) .
15
Autoselect Mode ................................................................................... 15
Table 12. Write Operation Status ....................................... 39
Absolute Maximum Ratings . . . . . . . . . . . . . . . . .40
Figure 9. Maximum Negative Overshoot Waveform................ 40
Figure 10. Maximum Positive Overshoot Waveform................ 40
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 40
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 41
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Table 4. Autoselect Codes (High Voltage Method) ..................16
Figure 11. Test Setup ........................................................ 42
Sector Protection/Unprotection ....................................................... 16
Table 13. Test Specifications ............................................. 42
TeFFmiiggpuuorreera12r..yTInSe-emScpytsootrreamUrynSSpienrcogtltoeercHUtign.hp..r.V.o..ot.e.l.tc.a.t.g..O.e..p.S.e.e.r..ca.t.t.oi.o.r.n..P...r....o...t..e....c...t.../......D.......a......t...a..1S177heet4AURC.ceFoaiCgdmuhOreapr1ea2r.caIttnieopnrusitsW.t..i.a.c.v.s.e..f...o..r..m.....s....a...n...d.....M....e...a..s...u...r..e...m.....e...n...t....L..e...v...e...l.s....................................444323
Unprotect Algorithms ........................................................ 18
SecSi (Secured Silicon) Sector Flash Memory Region ................ 19
Figure 13. Read Operations Timings .................................... 43
Hardware Reset (RESET#) ................................................................ 44
Table 5. SecSi Sector Addressing ........................................19
Customer Lockable: SecSi Sector NOT Programmed or Pro-
Figure 14. RESET# Timings ................................................ 44
Erase/Program Operations ................................................................ 45
tected At the Factory ........................................................................... 19
Figure 3. SecSi Sector Protect Verify ................................... 20
Common Flash Memory Interface (CFI) .......................................20
Table 6. CFI Query Identification String ...............................21
Table 7. System Interface String .........................................22
Table 8. Device Geometry Definition ....................................22
Table 9. Primary Vendor-Specific Extended Query .................23
Hardware Data Protection ................................................................ 23
Low VCC Write Inhibit ....................................................................... 23
Write Pulse “Glitch” Protection ...................................................... 23
Logical Inhibit ......................................................................................... 24
Power-Up Write Inhibit ..................................................................... 24
Command Definitions . . . . . . . . . . . . . . . . . . . . . .24
Reading Array Data ............................................................................. 24
Reset Command ................................................................................... 24
Autoselect Command Sequence ...................................................... 25
Word/Byte Program Command Sequence ................................... 25
Unlock Bypass Command Sequence ............................................... 26
Figure 4. Program Operation .............................................. 27
Figure 15. Program Operation Timings ................................. 46
Figure 16. Chip/Sector Erase Operation Timings.................... 47
Figure 17. Data# Polling Timings
(During Embedded Algorithms)........................................... 48
Figure 18. Toggle Bit Timings
(During Embedded Algorithms)........................................... 48
Figure 19. DQ2 vs. DQ6 for Erase and
Erase Suspend Operations ................................................. 49
Figure 20. Temporary Sector Unprotect/Timing Diagram ........ 49
Figure 21. Sector Protect/Unprotect Timing Diagram.............. 50
Figure 22. Alternate CE# Controlled Write Operation Timings.. 52
Erase and Programming Performance . . . . . . . . . 53
TSOP Pin and BGA Package Capacitance . . . . . 53
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 54
TS 048—48-Pin Standard TSOP ...................................................... 54
TSR048—48-Pin Reverse TSOP ...................................................... 55
FBA048—48-Ball Fine-Pitch Ball Grid Array (BGA)
6 x 8 mm Package ................................................................................. 56
LAA064—64-Ball Fortified Ball Grid Array (BGA)
13 x 11 mm Package ............................................................................... 57
Chip Erase Command Sequence ...................................................... 27
Revision Summary. . . . . . . . . . . . . . . . . . . . . . . . . 58
Sector Erase Command Sequence ..................................................28
Erase Suspend/Erase Resume Commands ....................................28
DataShee
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April 21, 2004 S29AL016M_00A4
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S29AL016M
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S29AL016M 電子部品, 半導体
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Connection Diagrams
Fine-pitch BGA
Top View, Balls Facing Down
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A6 B6 C6 D6 E6 F6 G6 H6
A13 A12 A14 A15 A16 BYTE# DQ15/A-1 VSS
A5 B5 C5 D5 E5 F5 G5 H5
A9 A8 A10 A11 DQ7 DQ14 DQ13 DQ6
A4 B4
WE# RESET#
C4
NC
A3
RY/BY#
B3
NC
C3
A18
D4 E4 F4 G4
A19 DQ5 DQ12 VCC
H4
DQ4
D3 E3 F3 G3 H3
NC DQ2 DQ10 DQ11 DQ3
A2 B2 C2 D2 E2 F2 G2 H2
A7 A17 A6
A5
DQ0
DQ8 DQ9
DQ1
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A1 B1 C1 D1 E1 F1 G1 H1
A3 A4 A2 A1 A0 CE# OE# VSS
DataShee
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S29AL016M
S29AL016M_00A4 April 21, 2004
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S29AL016M

16 MEGABIT (2M X 8 BIT / I M X 16 BIT) 3.0 VOLT ONLY BOOT SECTOR FLASH MEMORY

SPANSION
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