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PDF MC14094B Data sheet ( Hoja de datos )
| Número de pieza | MC14094B | |
| Descripción | 8-Stage Shift/Store Register with Three-State Outputs | |
| Fabricantes | Motorola Semiconductors | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de MC14094B (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
8-Stage Shift/Store Register
with Three-State Outputs
The MC14094B combines an 8–stage shift register with a data latch for
each stage and a three–state output from each latch.
Data is shifted on the positive clock transition and is shifted from the
seventh stage to two serial outputs. The QS output data is for use in
high–speed cascaded systems. The Q′S output data is shifted on the
following negative clock transition for use in low–speed cascaded systems.
Data from each stage of the shift register is latched on the negative
transition of the strobe input. Data propagates through the latch while strobe
is high.
Outputs of the eight data latches are controlled by three–state buffers
which are placed in the high–impedance state by a logic Low on Output
Enable.
• Three–State Outputs
• Capable of Driving Two Low–Power TTL Loads or One Low–Power
Schottky TTL Load Over the Rated Temperature Range
• Input Diode Protection
• Data Latch
• Dual Outputs for Data Out on Both Positive and Negative Clock
Transitions
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎΕ Useful for Serial–to–Parallel Data Conversion
• Pin–for–Pin Compatible with CD4094B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎMAXIMUM RATINGS* (Voltages Referenced to VSS)
Symbol
Parameter
Value
Unit
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎVDD DC Supply Voltage
– 0.5 to + 18.0
V
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎVin, Vout Input or Output Voltage (DC or Transient) – 0.5 to VDD + 0.5 V
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎIin, Iout Input or Output Current (DC or Transient), ± 10 mA
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎper Pin
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎPD Power Dissipation, per Package†
500 mW
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎTstg Storage Temperature
– 65 to + 150
_C
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎTL Lead Temperature (8–Second Soldering)
260 _C
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
Clock
Output
Enable
0
Strobe
X
Data
X
Parallel Outputs
Q1 QN
ZZ
Serial Outputs
QS* Q′S
Q7 No Chg.
0 XX Z
Z No Chg. Q7
1 0 X No Chg. No Chg. Q7 No Chg.
1
10
0
QN–1
Q7 No Chg.
1
11
1
QN–1
Q7 No Chg.
1 1 1 No Chg. No Chg. No Chg. Q7
Z = High Impedance X = Don’t Care
* At the positive clock edge, information in the 7th shift register stage is transferred to
Q8 and QS.
MC14094B
L SUFFIX
CERAMIC
CASE 620
P SUFFIX
PLASTIC
CASE 648
D SUFFIX
SOIC
CASE 751B
ORDERING INFORMATION
MC14XXXBCP
MC14XXXBCL
MC14XXXBD
Plastic
Ceramic
SOIC
TA = – 55° to 125°C for all packages.
PIN ASSIGNMENT
STROBE
DATA
CLOCK
Q1
Q2
Q3
Q4
VSS
1
2
3
4
5
6
7
8
16 VDD
15
OUTPUT
ENABLE
14 Q5
13 Q6
12 Q7
11 Q8
10 Q′S
9 QS
This device contains protection circuitry to
guard against damage due to high static
voltages or electric fields. However, pre-
cautions must be taken to avoid applications of
any voltage higher than maximum rated volt-
ages to this high–impedance circuit. For proper
v voperation, Vin and Vout should be constrained
to the range VSS (Vin or Vout) VDD.
Unused inputs must always be tied to an
appropriate logic voltage level (e.g., either VSS
or VDD). Unused outputs must be left open.
REV 3
1/94
©MMOotoTrOolaR, IOncL. A199C5MOS LOGIC DATA
MC14094B
1
1 page  
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16 9
–B–
18
CL
–T–
SEATING
PLANE
F
NK
E
G
D 16 PL
0.25 (0.010) M T A S
M
J 16 PL
0.25 (0.010) M T B S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC
1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC
2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC
7.62 BSC
M 0_ 15_ 0_ 15_
N 0.020 0.040 0.51 1.01
–A–
16
1
H
G
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
9
B
8
FC
S
L
–T–
SEATING
PLANE
KJ
D 16 PL
0.25 (0.010) M T A M
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC
2.54 BSC
H 0.050 BSC
1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0_ 10_ 0_ 10 _
S 0.020 0.040 0.51 1.01
MOTOROLA CMOS LOGIC DATA
MC14094B
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet MC14094B.PDF ] | |
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