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MMBT2369ALT1 の電気的特性と機能

MMBT2369ALT1のメーカーはONです、この部品の機能は「Switcing Transistors」です。


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部品番号 MMBT2369ALT1
部品説明 Switcing Transistors
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MMBT2369ALT1 Datasheet, MMBT2369ALT1 PDF,ピン配置, 機能
www.DataSheet4U.com
MMBT2369LT1,
MMBT2369ALT1
MMBT2369ALT1 is a Preferred Device
Switching Transistors
NPN Silicon
Features
Pb−Free Packages are Available
MAXIMUM RATINGS
Rating
Collector −Emitter Voltage
Collector −Emitter Voltage
Collector −Base Voltage
Emitter −Base Voltage
Collector Current − Continuous
THERMAL CHARACTERISTICS
Symbol
VCEO
VCES
VCBO
VEBO
IC
Value
15
40
40
4.5
200
Unit
Vdc
Vdc
Vdc
Vdc
mAdc
Characteristic
Total Device Dissipation FR− 5 Board
(Note 1) TA = 25°C
Derate above 25°C
Symbol
Max
Unit
PD
225 mW
1.8 mW/°C
Thermal Resistance, Junction−to−Ambient
Total Device Dissipation Alumina
Substrate, (Note 2) TA = 25°C
Derate above 25°C
RqJA
PD
556 °C/W
300 mW
2.4 mW/°C
Thermal Resistance, Junction−to−Ambient RqJA
417 °C/W
Junction and Storage Temperature
TJ, Tstg −55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0  0.75  0.062 in.
2. Alumina = 0.4  0.3  0.024 in. 99.5% alumina.
© Semiconductor Components Industries, LLC, 2007
January, 2007 − Rev. 5
1
http://onsemi.com
COLLECTOR
3
1
BASE
2
EMITTER
3
1
2
SOT−23
CASE 318
STYLE 6
MARKING DIAGRAMS
xxx M G
G
1
xxx = M1J or 1JA
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping
MMBT2369LT1
MMBT2369LT1G
MMBT2369ALT1
SOT−23 3000/Tape & Reel
SOT−23 3000/Tape & Reel
(Pb−Free)
SOT−23 3000/Tape & Reel
MMBT2369ALT1G SOT−23 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
Publication Order Number:
MMBT2369LT1/D

1 Page





MMBT2369ALT1 pdf, ピン配列
MMBT2369LT1, MMBT2369ALT1
+10.6 V
0
−1.5 V
t1
< 1 ns
PULSE WIDTH (t1) = 300 ns
DUTY CYCLE = 2%
270 W
3V
3.3 k
Cs* < 4 pF
+10.75 V
t1
0
−9.15 V
< 1 ns
PULSE WIDTH (t1) = 300 ns
DUTY CYCLE = 2%
270 W
3.3 k
*Total shunt capacitance of test jig and connectors.
Figure 1. ton Circuit − 10 mA
Figure 2. toff Circuit − 10 mA
Cs* < 4 pF
+10.8 V
t1
95 W
10 V
0
−2 V
< 1 ns
PULSE WIDTH (t1) = 300 ns
DUTY CYCLE = 2%
1k
Cs* < 12 pF
+11.4 V
t1
95 W
10 V
0
−8.6 V
< 1 ns
PULSE WIDTH (t1) BETWEEN
10 AND 500 ms
DUTY CYCLE = 2%
1k
1N916
*Total shunt capacitance of test jig and connectors.
Cs* < 12 pF
Figure 3. ton Circuit − 100 mA
Figure 4. toff Circuit − 100 mA
TURN−ON WAVEFORMS
Vin
0 10%
Vout 90%
ton
Vin
PULSE GENERATOR
Vin RISE TIME < 1 ns
SOURCE IMPEDANCE = 50 W
PW 300 ns
DUTY CYCLE < 2%
3.3 kW
50 W
220 W
0.1 mF
3.3 k 50 W
0.0023 mF 0.0023 mF
0.005 mF 0.005 mF
VBB
+
0.1 mF
0.1 mF
+
VCC
=
3
V
TO OSCILLOSCOPE
INPUT IMPEDANCE = 50 W
RISE TIME = 1 ns
Vout TURN−OFF WAVEFORMS
0
Vin
10%
Vout 90%
VBB = +12 V
toff Vin = −15 V
Figure 5. Turn−On and Turn−Off Time Test Circuit
http://onsemi.com
3


3Pages


MMBT2369ALT1 電子部品, 半導体
MMBT2369LT1, MMBT2369ALT1
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
E
A
A1
D
3
12
e
SEE VIEW C
HE
b
c
0.25
q
L
L1
VIEW C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.
MILLIMETERS
DIM MIN NOM MAX
A 0.89
1.00
1.11
A1 0.01
0.06
0.10
b 0.37
0.44
0.50
c 0.09 0.13 0.18
D 2.80
2.90
3.04
E 1.20
1.30
1.40
e 1.78 1.90 2.04
L 0.10
0.20
0.30
L1 0.35
0.54
0.69
H E 2.10
2.40
2.64
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
0.8
0.031
ǒ ǓSCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
http://onsemi.com
6
MMBT2369LT1/D

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