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MMBD1000LT1 の電気的特性と機能

MMBD1000LT1のメーカーはMotorola Semiconductorsです、この部品の機能は「Switching Diode」です。


製品の詳細 ( Datasheet PDF )

部品番号 MMBD1000LT1
部品説明 Switching Diode
メーカ Motorola Semiconductors
ロゴ Motorola Semiconductors ロゴ 




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MMBD1000LT1 Datasheet, MMBD1000LT1 PDF,ピン配置, 機能
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MMBD1000LT1/D
Switching Diode
Part of the GreenLinePortfolio of devices with energy–conserving traits.
This switching diode has the following features:
Very Low Leakage (500 pA) promotes extended battery life by decreas-
ing energy waste
Offered in four Surface Mount package types
Available in 8 mm Tape and Reel in quantities of 3,000
Applications
ESD Protection
Reverse Polarity Protection
Steering Logic
Medium–Speed Switching
MMBD1000LT1
MMBD2000T1
MMBD3000T1
MMSD1000T1
Motorola Preferred Devices
MMBD1000LT1
3
1
2
CASE 318-07, STYLE 8
SOT-23 (TO-236AB)
3
CATHODE
1
ANODE
MAXIMUM RATINGS
Rating
Symbol
Value
Continuous Reverse Voltage
Peak Forward Current
Peak Forward Surge Current
VR
IF
IFM
(surge)
30
200
500
DEVICE MARKING
MMBD1000LT1 = AY
MMBD2000T1 = DH
MMBD3000T1 = XP
MMSD1000T1 = 4K
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Total Device Dissipation FR-4 Board (1)
TA = 25°C
MMBD1000LT1, MMBD3000T1,
MMSD1000T1
MMBD2000T1
Derate above 25°C MMBD1000LT1, MMBD3000T1,
MMSD1000T1
MMBD2000T1
PD
225
150
1.8
1.2
Thermal Resistance Junction to Ambient
MMBD1000LT1, MMBD3000T1,
MMSD1000T1
MMBD2000T1
RθJA
556
833
Junction and Storage Temperature
TJ, Tstg – 55 to +150
(1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum
recommended footprint.
GreenLine is a trademark of Motorola, Inc.
Thermal Clad is a registered trademark of the Berquist Company.
Preferred devices are Motorola recommended choices for future use and best overall value.
Unit
Vdc
mAdc
mA
Unit
mW
mW/°C
°C/W
°C
MMBD2000T1
3
1
2
CASE 419-02, STYLE 2
SC–70/SOT–323
3
CATHODE
1
ANODE
MMBD3000T1
3
2
1
CASE 318D-03, STYLE 2
SC–59
3
CATHODE
2
ANODE
MMSD1000T1
2
1
CASE 425-04, STYLE 1
SOD–123
1
CATHODE
2
ANODE
©MMotootorroollaa, SInmc. 1a9ll95Signal Transistors, FETs and Diodes Device Data
1

1 Page





MMBD1000LT1 pdf, ピン配列
MMBD1000LT1 MMBD2000T1 MMBD3000T1 MMSD1000T1
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
0.037
0.95
0.037
0.95
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.037
0.95
0.037
0.95
0.039
1.0
0.098-0.118
2.5-3.0
0.094
2.4
0.031
0.8
inches
mm
SC–59
0.035
0.9
0.079
2.0
0.031
0.8
SOT–23
inches
mm
0.025
0.65
0.025
0.65
0.035
0.9
0.075
1.9
0.028
0.7
SC–70/SOT–323
inches
mm
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉ00ÉÉÉÉÉÉ..09316ÉÉÉÉÉÉ
1.22
0.048
2.36
0.093
4.19 mm
0.165
inches
SOD–123
POWER DISSIPATION FOR A SURFACE MOUNT DEVICE
The power dissipation for a surface mount device is a
function of the drain/collector pad size. These can vary from
the minimum pad size for soldering to a pad size given for
maximum power dissipation. Power dissipation for a surface
mount device is determined by TJ(max), the maximum rated
junction temperature of the die, RθJA, the thermal resistance
from the device junction to ambient, and the operating
temperature, TA. Using the values provided on the data
sheet, PD can be calculated as follows:
PD =
TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25°C, one can
calculate the power dissipation of the device. For example,
for a SOT–23 device, PD is calculated as follows.
PD =
150°C – 25°C
556°C/W
= 225 milliwatts
The 556°C/W for the SOT–23 package assumes the use
of the recommended footprint on a glass epoxy printed circuit
board to achieve a power dissipation of 250 milliwatts. There
are other alternatives to achieving higher power dissipation
from the surface mount packages. One is to increase the
area of the drain/collector pad. By increasing the area of the
drain/collector pad, the power dissipation can be increased.
Although the power dissipation can almost be doubled with
this method, area is taken up on the printed circuit board
which can defeat the purpose of using surface mount
technology.
Another alternative would be to use a ceramic substrate or
an aluminum core board such as Thermal Clad. Using a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
Motorola Small–Signal Transistors, FETs and Diodes Device Data
3


3Pages


MMBD1000LT1 電子部品, 半導体
MMBD1000LT1 MMBD2000T1 MMBD3000T1 MMSD1000T1
PACKAGE DIMENSIONS
A
L
3
BS
12
VG
C
D H KJ
CASE 318–07
ISSUE AD
SOT–23 (TO–236AB)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
INCHES
DIM MIN MAX
A 0.1102 0.1197
B 0.0472 0.0551
C 0.0350 0.0440
D 0.0150 0.0200
G 0.0701 0.0807
H 0.0005 0.0040
J 0.0034 0.0070
K 0.0180 0.0236
L 0.0350 0.0401
S 0.0830 0.0984
V 0.0177 0.0236
MILLIMETERS
MIN MAX
2.80 3.04
1.20 1.40
0.89 1.11
0.37 0.50
1.78 2.04
0.013 0.100
0.085 0.177
0.45 0.60
0.89 1.02
2.10 2.50
0.45 0.60
STYLE 8:
PIN 1.
2.
3.
ANODE
NO CONNECTION
CATHODE
A
L
3
S
1
B
2
VD
G
0.05 (0.002)
H
C RN
J
K
CASE 419–02
ISSUE E
SC–70/SOT–323
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 0.071 0.087
B 0.045 0.053
C 0.035 0.049
D 0.012 0.016
G 0.047 0.055
H 0.000 0.004
J 0.004 0.010
K 0.017 REF
L 0.026 BSC
N 0.028 REF
R 0.031 0.039
S 0.079 0.087
V 0.012 0.016
MILLIMETERS
MIN MAX
1.80 2.20
1.15 1.35
0.90 1.25
0.30 0.40
1.20 1.40
0.00 0.10
0.10 0.25
0.425 REF
0.650 BSC
0.700 REF
0.80 1.00
2.00 2.20
0.30 0.40
STYLE 2:
PIN 1. ANODE
2. N.C.
3. CATHODE
6 Motorola Small–Signal Transistors, FETs and Diodes Device Data

6 Page



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部品番号部品説明メーカ
MMBD1000LT1

Switching Diode

Motorola Semiconductors
Motorola Semiconductors


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