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MC14013BのメーカーはON Semiconductorです、この部品の機能は「Dual Type D Flip-Flop」です。 |
部品番号 | MC14013B |
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部品説明 | Dual Type D Flip-Flop | ||
メーカ | ON Semiconductor | ||
ロゴ | |||
このページの下部にプレビューとMC14013Bダウンロード(pdfファイル)リンクがあります。 Total 8 pages
MC14013B
Dual Type D Flip-Flop
The MC14013B dual type D flip−flop is constructed with MOS
P−channel and N−channel enhancement mode devices in a single
monolithic structure. Each flip−flop has independent Data, (D), Direct
Set, (S), Direct Reset, (R), and Clock (C) inputs and complementary
outputs (Q and Q). These devices may be used as shift register
elements or as type T flip−flops for counter and toggle applications.
Features
• Static Operation
• Diode Protection on All Inputs
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• Logic Edge−Clocked Flip−Flop Design
• Logic State is Retained Indefinitely with Clock Level either High or
Low; Information is Transferred to the Output only on the
Positive−going Edge of the Clock Pulse
• Capable of Driving Two Low−power TTL Loads or One Low−power
Schottky TTL Load Over the Rated Temperature Range
• Pin−for−Pin Replacement for CD4013B
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free and are RoHS Compliant
http://onsemi.com
SOIC−14
D SUFFIX
CASE 751A
SOEIAJ−14
F SUFFIX
CASE 965
TSSOP−14
DT SUFFIX
CASE 948G
PIN ASSIGNMENT
QA 1
QA 2
CA 3
RA 4
DA 5
SA 6
VSS 7
14 VDD
13 QB
12 QB
11 CB
10 RB
9 DB
8 SB
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol
Parameter
Value
Unit
VDD
Vin, Vout
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
−0.5 to +18.0
−0.5 to VDD + 0.5
V
V
Iin, Iout Input or Output Current
(DC or Transient) per Pin
±10 mA
PD Power Dissipation, per Package
(Note 1)
500 mW
TA Ambient Temperature Range
−55 to +125
°C
Tstg Storage Temperature Range
−65 to +150
°C
TL Lead Temperature
(8−Second Soldering)
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Temperature Derating: “D/DW” Packages: –7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
MARKING DIAGRAMS
14
14013BG
AWLYWW
1
SOIC−14
14
MC14013B
ALYWG
1
SOEIAJ−14
14
14
013B
ALYW G
G
1
TSSOP−14
A
WL, L
YY, Y
WW, W
G or G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
July, 2014 − Rev. 10
1
Publication Order Number:
MC14013B/D
1 Page MC14013B
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
−55_C
25_C
125_C
VDD
Symbol Vdc Min Max Min Typ (2) Max Min Max Unit
Output Voltage
Vin = VDD or 0
“0” Level VOL
5.0
10
15
− 0.05
− 0.05
− 0.05
−
−
−
0 0.05 − 0.05 Vdc
0 0.05 − 0.05
0 0.05 − 0.05
Vin = 0 or VDD
“1” Level VOH
5.0 4.95
−
4.95
5.0
10 9.95 − 9.95
10
15 14.95
− 14.95
15
− 4.95 −
− 9.95 −
− 14.95 −
Vdc
Input Voltage
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
“0” Level
(VO = 0.5 or 4.5 Vdc) “1” Level
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
Source
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Sink
Input Current
Input Capacitance
(Vin = 0)
Quiescent Current
(Per Package)
VIL
VIH
IOH
IOL
Iin
Cin
IDD
5.0 − 1.5 −
10 − 3.0 −
15 − 4.0 −
Vdc
2.25 1.5 − 1.5
4.50 3.0 − 3.0
6.75 4.0 − 4.0
5.0 3.5 − 3.5 2.75
10 7.0 − 7.0 5.50
15 11 − 11 8.25
− 3.5 − Vdc
− 7.0 −
− 11 −
5.0 –3.0 − –2.4 –4.2
5.0 –0.64 − –0.51 –0.88
10 –1.6 − −1.3 –2.25
15 –4.2
−
−3.4
−8.8
mAdc
− –1.7 −
− −0.36 −
− –0.9 −
− −2.4 −
5.0 0.64 − 0.51 0.88
10 1.6 − 1.3 2.25
15 4.2 − 3.4 8.8
− 0.36 − mAdc
− 0.9 −
− 2.4 −
15 − ±0.1 — ± 0.00001 ±0.1 − ±1.0 mAdc
− − − − 5.0 7.5 − − pF
5.0 − 1.0
−
0.002
1.0
−
30 mAdc
10
− 2.0
−
0.004
2.0
−
60
15
−
4.0
−
0.006
4.0
− 120
Total Supply Current (3) (4)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
IT 5.0
10
15
IT = (0.75 mA/kHz) f + IDD
IT = (1.5 mA/kHz) f + IDD
IT = (2.3 mA/kHz) f + IDD
mAdc
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25_C.
4. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL − 50) Vfk
where: IT is in mA (per package), CL in pF, V = (VDD − VSS) in volts, f in kHz is input frequency, and k = 0.002.
http://onsemi.com
3
3Pages MC14013B
PACKAGE DIMENSIONS
14
H
1
0.25 M B M
D
e
SOIC−14 NB
CASE 751A−03
ISSUE K
A
B
8
E
7
13X b
0.25 M C A S
BS
A
A1
C
SEATING
PLANE
L
DETAIL A
h
X 45 _
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
A3 PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
DETAIL A
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 1.35 1.75 0.054 0.068
A1 0.10 0.25 0.004 0.010
A3 0.19 0.25 0.008 0.010
b 0.35 0.49 0.014 0.019
D 8.55 8.75 0.337 0.344
E 3.80 4.00 0.150 0.157
e 1.27 BSC
0.050 BSC
H 5.80 6.20 0.228 0.244
h 0.25 0.50 0.010 0.019
L 0.40 1.25 0.016 0.049
M 0_ 7_ 0_ 7_
SOLDERING FOOTPRINT*
6.50
1
14X
1.18
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
6 Page | |||
ページ | 合計 : 8 ページ | ||
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部品番号 | 部品説明 | メーカ |
MC14013 | Dual Type D Flip-Flop | ON Semiconductor |
MC14013 | Dual Type D Flip-Flop | Motorola Semiconductors |
MC14013B | Dual Type D Flip-Flop | ON Semiconductor |
MC14013B | Dual Type D Flip-Flop | Motorola Semiconductors |