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PDF PZT751T1 Data sheet ( Hoja de datos )
| Número de pieza | PZT751T1 | |
| Descripción | PNP Silicon Planar Epitaxial Transistor | |
| Fabricantes | ON Semiconductor | |
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PZT751T1
Preferred Device
PNP Silicon Planar
Epitaxial Transistor
This PNP Silicon Epitaxial transistor is designed for use in
industrial and consumer applications. The device is housed in the
SOT−223 package which is designed for medium power surface
mount applications.
Features
• High Current: 2.0 A
• The SOT−223 Package can be soldered using wave or reflow.
• SOT−223 package ensures level mounting, resulting in improved
thermal conduction, and allows visual inspection of soldered joints.
The formed leads absorb thermal stress during soldering, eliminating
the possibility of damage to the die
www.DataSh•eeNtP4NUC.coommplement is PZT651T1
• Pb−Free Package is Available
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol Value
Unit
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Collector Current
Total Power Dissipation
Derate above 25°C
@
TA
=
25°C(1)
VCEO
VCBO
VEBO
IC
PD
60 Vdc
80 Vdc
5.0 Vdc
2.0 Adc
0.8 W
6.4 mW/°C
Storage Temperature Range
Junction Temperature
THERMAL CHARACTERISTICS
Tstg − 65 to 150 °C
TJ 150 °C
Rating
Symbol Value
Unit
Thermal Resistance from Junction−to−
Ambient in Free Air
RqJA
156
°C/W
Maximum Temperature for Soldering TL 260 °C
Purposes
Time in Solder Bath
10 Sec
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Device mounted on a FR−4 glass epoxy printed circuit board using minimum
recommended footprint.
http://onsemi.com
SOT−223 PACKAGE
HIGH CURRENT
PNP SILICON TRANSISTOR
SURFACE MOUNT
COLLECTOR 2, 4
BASE
1
EMITTER 3
MARKING
DIAGRAM
TO−261AA
CASE 318E
STYLE 1
D
ZT 751
ZT 751 = Specific Device Code
D = Date Code
ORDERING INFORMATION
Device
Package
Shipping
PZT751T1
SOT−223 1000 / Tape & Reel
PZT751T1G
SOT−223 1000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
Semiconductor Components Industries, LLC, 2004
January, 2004 − Rev. 4
1
Publication Order Number:
PZT751T1/D
1 page  
PZT751T1
PACKAGE DIMENSIONS
SOT−223 (TO−261)
CASE 318E−04
ISSUE K
A
F
4
S
1 23
B
LG
0.08 (0003)
www.DataSheet4U.com
H
D
C
M
J
K
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 0.249 0.263
B 0.130 0.145
C 0.060 0.068
D 0.024 0.035
F 0.115 0.126
G 0.087 0.094
H 0.0008 0.0040
J 0.009 0.014
K 0.060 0.078
L 0.033 0.041
M 0_ 10 _
S 0.264 0.287
MILLIMETERS
MIN MAX
6.30 6.70
3.30 3.70
1.50 1.75
0.60 0.89
2.90 3.20
2.20 2.40
0.020 0.100
0.24 0.35
1.50 2.00
0.85 1.05
0 _ 10 _
6.70 7.30
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
1.5
0.059
ǒ ǓSCALE 6:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
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| PDF Descargar | [ Datasheet PZT751T1.PDF ] | |
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