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74F1071MSA の電気的特性と機能

74F1071MSAのメーカーはFairchild Semiconductorです、この部品の機能は「18-Bit Undershoot/Overshoot Clamp」です。


製品の詳細 ( Datasheet PDF )

部品番号 74F1071MSA
部品説明 18-Bit Undershoot/Overshoot Clamp
メーカ Fairchild Semiconductor
ロゴ Fairchild Semiconductor ロゴ 




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74F1071MSA Datasheet, 74F1071MSA PDF,ピン配置, 機能
October 1994
Revised August 1999
74F1071
18-Bit Undershoot/Overshoot Clamp
and ESD Protection Device
General Description
The 74F1071 is an 18-bit undershoot/overshoot clamp
which is designed to limit bus voltages and also to protect
more sensitive devices from electrical overstress due to
electrostatic discharge (ESD). The inputs of the device
aggressively clamp voltage excursions nominally at 0.5V
below and 7V above ground.
Features
s 18-bit array structure in 20-pin package
s FAST® Bipolar voltage clamping action
s Dual center pin grounds for min inductance
s Robust design for ESD protection
s Low input capacitance
s Optimum voltage clamping for 5V CMOS/TTL
applications
Ordering Code:
Order Number Package Number
Package Description
74F1071SC
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
74F1071MSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
74F1071MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagram
Note: Simplified Component Representation
FAST® is a registered trademark of Fairchild Semiconductor Corporation.
© 1999 Fairchild Semiconductor Corporation DS011685
www.fairchildsemi.com

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74F1071MSA pdf, ピン配列
DC Electrical Characteristics
Typical Forward and Reverse V/I
Characteristics
Typical Reverse Conduction
Characteristics
Typical Forward Conduction
Characteristics
ESD Network
Human Body Model
IEC 801-2
CZ
100 pF
150 pF
RZ
1500
330
Simulated ESD Voltage Clamping Test Circuit
3 www.fairchildsemi.com


3Pages


74F1071MSA 電子部品, 半導体
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
www.fairchildsemi.com
6

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部品番号部品説明メーカ
74F1071MSA

18-Bit Undershoot/Overshoot Clamp

Fairchild Semiconductor
Fairchild Semiconductor


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