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PDF CXA1851 Data sheet ( Hoja de datos )
| Número de pieza | CXA1851 | |
| Descripción | Up/Down Converter for 900 MHz-Band Mobile Communications | |
| Fabricantes | Sony Corporation | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de CXA1851 (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
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CXA1851N
Up/Down Converter for 900 MHz-Band Mobile Communications
For the availability of this product, please contact the sales office.
Description
The CXA1851N is an up/down converter IC for
900 MHz-band mobile communications.
This is suitable for 900 MHz-band digital cordless
telephone (CT2) and digital cellular.
20 pin SSOP (Plastic)
Features
• Transmission/reception converter on a single chip
• Operating frequency: 800 to 900 MHz
• Supply voltage: 2.7 to 4.5 V
• Power saving function
• 20-pin SSOP package used for set size reduction
Applications
• CT2 digital cordless telephone
• Digital cellular
Structure
Bipolar silicon monolithic IC
Block Diagram and Pin Configuration
Absolute Maximum Ratings (Ta=25°C)
• Supply voltage
Vcc 5
V
• Operating temperature Topr –20 to +75 °C
• Storage temperature Tstg –65 to +150 °C
• Allowable power dissipation
PD
530∗
mW
∗ When mounted on a 505×0×1.6 mm copper-
foiled glass epoxy board
Recommended Operating Conditions
Supply voltage
Vcc 2.7 to 4.5
V
20 19 18 17 16 15 14 13 12 11
MIX
MIX
1 2 3 4 5 6 7 8 9 10
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
—1—
E93505-TE
1 page  
Electrical Characteristics Test Circuit 1
LO SG
CXA1851N
220n
IF SG
20 19 18 17 16 15 14 13 12 11
MIX
10p
4.7N
MIX
1 2 3 4 5 6 7 8 9 10
180p 1500p
—5—
5 Page 
CXA1851N
Notes on Operation
(1) Electrostatic sensitive diveces because of the high-frequency process.
(2) Earth pattern should be as wide as possible and do not increase ground impedanse to prevent from the
parasitic osellation.
(3) Wire the GND pin as short as possible.
(4) Connect a by-pass capacitor to the VCC pin.
—11—
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet CXA1851.PDF ] | |
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