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FDZ1040LのメーカーはFairchild Semiconductorです、この部品の機能は「Integrated Load Switch」です。 |
部品番号 | FDZ1040L |
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部品説明 | Integrated Load Switch | ||
メーカ | Fairchild Semiconductor | ||
ロゴ | |||
このページの下部にプレビューとFDZ1040Lダウンロード(pdfファイル)リンクがあります。 Total 11 pages
April 2013
FDZ1040L
Integrated Load Switch
Features
Optimized for Low-Voltage Core ICs in Portable
Systems
Very Small Package Dimension: WLCSP
0.8 X 0.8 X 0.5 mm3
Current = 1.2 A, VIN max = 4 V
Current = 2 A, VIN max = 4 V (Pulsed)
RDS(on) = 80 mΩ at VON = VIN = 4 V
RDS(on) = 85 mΩ at VON = VIN = 3.6 V
RDS(on) = 90 mΩ at VON = VIN = 3 V
RDS(on) = 110 mΩ at VON = 0.7 V, VIN = 1.6 V
RDS(on) = 309 mΩ at VON = 0.7 V, VIN = 1 V
RoHS Compliant
Description
This device is particularly suited for compact power
management in portable applications needing 1 V to 4 V
input and 1.2 A output current capability. This load
switch integrated a level-shifting function that drives a P-
channel power MOSFET in a very small 0.8 X 0.8 X
0.5 mm3 WLCSP package.
Applications
Load Switch
Power Management in Portable Applications
GND
ON
VOUT
VIN Pin 1
Figure 1. Bottom View
Figure 2. Top View
Ordering Information
Part
Number
FDZ1040L
Device
Mark
ZL
Ball
Pitch
0.4 mm
Operating
Temperature Range
Switch
-40 to 85°C
80 m, P-Channel
MOSFET
Package
0.8 x 0.8 x
0.5 mm3 WLCSP
Packing
Method
Tape & Reel
© 2010 Fairchild Semiconductor Corporation
FDZ1040L • Rev. D1
www.fairchildsemi.com
1 Page Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min. Max. Unit
VIN
IOUT_C
IOUT_P
PD
TA
TSTG
RΘJA
Voltage on VIN, VOUT, ON to GND
IOUT-Load Current (Continuous)(1a)
IOUT-Load Current (Pulsed)
Power Dissipation at TA = 25°C(1a)
Operating Temperature Range
Storage Temperature
Thermal Resistance, Junction to Ambient(1a)
-0.3 4.2
V
1.2 A
2A
0.9 W
-40 85 °C
-65 150 °C
135 °C/W
Human Body Model, JESD22-A114
ESD Electrostatic Discharge Capability
Charged Device Model, JESD22-C101
8
2
kV
Notes:
1. RΘJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal
reference is defined as the solder mounting surface of the drain pins. RΘJC is guaranteed by design, while RΘJA
is determined by the board design.
a. 117°C/W when mounted on a
1-inch square pad of 2-oz copper.
2. Pulse test: pulse width < 300 µs; duty cycle < 2.0%.
b. 277°C/W when mounted on a
minimum pad of 2-oz copper.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
VIN Voltage on VIN Pin
VON Voltage on ON Pin
TA Operating Temperature Range
Min.
1
0.7
-40
Max.
4
4.0
85
Unit
V
V
°C
© 2010 Fairchild Semiconductor Corporation
FDZ1040L • Rev. D1
3
www.fairchildsemi.com
3Pages Typical Performance Characteristics
Figure 13. RON vs. Temperature
Figure 14. RON vs. Supply Voltage
Figure 15. ON-Pin Threshold vs. VIN
Figure 16. VOUT Rise and Fall Time vs. Temperature
at RL=500 Ω
Figure 17. VOUT Turn-On and Turn-Off Delay
vs. Temperature at RL=500 Ω
Figure 18. Forward Bias Safe Operation Area
© 2010 Fairchild Semiconductor Corporation
FDZ1040L • Rev. D1
6
www.fairchildsemi.com
6 Page | |||
ページ | 合計 : 11 ページ | ||
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部品番号 | 部品説明 | メーカ |
FDZ1040L | Integrated Load Switch | Fairchild Semiconductor |