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PDF ISL9120IR Data sheet ( Hoja de datos )
| Número de pieza | ISL9120IR | |
| Descripción | Compact High Efficiency Low Power Buck-Boost Regulator | |
| Fabricantes | Intersil | |
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DATASHEET
Compact High Efficiency Low Power Buck-Boost
Regulator
ISL9120IR
The ISL9120IR is a highly integrated buck-boost switching
regulator that accepts input voltages either above or below the
regulated output voltage. This regulator automatically transitions
between buck and boost modes without significant output
disturbance. The ISL9120IR also has automatic bypass
functionality for when the input voltage is generally within 1% to
2% of the output voltage, there will be a direct bypass connection
between the VIN and VOUT pins. In addition to the automatic
bypass functionality, the ISL9120IR also has a forced bypass
functionality with the use of the BYPS pin.
This device is capable of delivering up to 800mA of output
current (VIN = 2.5V, VOUT = 3.3V) and provides excellent
efficiency due to its adaptive current limit pulse frequency
modulation (PFM) control architecture.
The ISL9120IR is designed for stand-alone applications and
supports a 3.3V fixed output voltage or variable output voltages
with an external resistor divider. The forced bypass power saving
mode can be chosen if voltage regulation is not required. The
device consumes less than 3.5µA of current over the operating
temperature range in the forced bypass mode.
The ISL9120IR requires only a single inductor and very few
external components. Power supply solution size is minimized by
a 3mmx3mm 12 Ld TQFN package.
Features
• Accepts input voltages above or below regulated output
voltage
• Automatic bypass mode functionality
• Automatic and seamless transitions between buck and boost
modes
• Input voltage range: 1.8V to 5.5V
• Selectable forced bypass power saving mode
• Adaptive multilevel current limit scheme to optimize efficiency
at low and high currents
• Output current: up to 800mA (VIN = 2.5V, VOUT = 3.3V)
• High efficiency: up to 98%
• 41µA quiescent current maximizes light-load efficiency
• Fully protected for over-temperature and undervoltage
• Small 3mmx3mm 12 Ld TQFN package
Applications
• Smartphones and tablets
• Portable consumer and wearable devices
VIN =
1.8V TO 5.5V
C1
10µF
ENABLE
DISABLE
BYPASS
BUCK-BOOST
ISL9120IRNZ
VIN LX1
EN
BYPS
LX2
VOUT
FB
L1
1µH
VOUT = 3.3V
C2
22µF or 47µF
FIGURE 1. TYPICAL FIXED OUTPUT APPLICATION
100
VIN = 3.6V
95
90
VIN = 4V
85
VIN = 3.4V
80
VIN = 2.5V
VIN = 3V
75
70
1 10 100
OUTPUT CURRENT (mA)
FIGURE 2. EFFICIENCY: VOUT = 3.3V, TA = +25°C
1000
February 2, 2016
FN8743.1
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2015, 2016. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
1 page  
ISL9120IR
Analog Specifications VIN = VEN = 3.6V, VOUT = 3.3V, L1 = 1µH, C1 = 10µF, C2 = 47µF, TA = +25°C. Boldface limits apply across the
recommended operating temperature range, -40°C to +85°C and input voltage range (1.8V to 5.5V). (Continued)
SYMBOL
PARAMETER
TEST CONDITIONS
MIN MAX
(Note 6) TYP (Note 6) UNIT
SOFT-START AND SOFT DISCHARGE
tSS Soft-Start Time
Time from when EN signal asserts to when output
voltage ramp starts.
1
ms
rDISCHG VOUT Soft-Discharge ON-Resistance
POWER MOSFET
Time from when output voltage ramp starts to when
output voltage reaches 95% of its nominal value
with device operating in buck mode.
VIN = 4V, IOUT = 500mA
Time from when output voltage ramp starts to when
output voltage reaches 95% of its nominal value
with device operating in boost mode.
VIN = 3V, IOUT = 500mA
EN < VIL
1
1
110
ms
ms
Ω
rDSON_P P-Channel MOSFET ON-Resistance
rDSON_N N-Channel MOSFET ON-Resistance
INDUCTOR PEAK CURRENT LIMIT
IOUT = 200mA, measured with internal test mode
IOUT = 200mA, measured with internal test mode
63
63
mΩ
mΩ
ILIM_MAX Maximum Peak Current Limit
THERMAL PROTECTION
2A
Thermal Shutdown
150 °C
Thermal Shutdown Hysteresis
35 °C
LOGIC INPUTS
ILEAK
Input Leakage
0.013 0.500
µA
VIH Input HIGH Voltage
1.4 V
VIL Input LOW Voltage
0.4 V
NOTES:
6. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
7. Quiescent current measurements are taken when the output is not switching.
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February 2, 2016
5 Page 
ISL9120IR
Inductor Selection
An inductor with high frequency core material (e.g., ferrite core)
should be used to minimize core losses and provide good
efficiency. The inductor must be able to handle the peak
switching currents without saturating.
A 1µH inductor with ≥2A saturation current rating is
recommended. Select an inductor with low DCR to provide good
efficiency. In applications where radiated noise must be
minimized, a toroidal or shielded inductor can be used.
TABLE 1. INDUCTOR VENDOR INFORMATION
MANUFACTURER
SERIES
DIMENSION
(mm)
Toko
DFE201610R-H-
1R0M
2.0x1.6x1.0
Cyntec
PIFE20161T-1R0MS 2.0x1.6x1.0
TDK TFM201610GHM- 2.0x1.6x1.0
1R0MTAA
DCR
(mΩ)
TYP
66
65
50
ISAT
(A)
TYP
2.7
2.8
3.8
Capacitor Selection
The input and output capacitors should be ceramic X5R type with
low ESL and ESR. The recommended input capacitor value is
10µF. The recommended 10µF input capacitor should have the
following minimum characteristics: 0603 case size, X5R
temperature range and 10V voltage rating. The recommended
VOUT capacitor values are 22µF or 47µF. The recommended
47µF output capacitor should have the following minimum
characteristics: 0603 case size, X5R temperature range and 6.3V
voltage rating. The recommended 22µF output capacitor should
have the following minimum characteristics: 0603 case size,
X5R temperature range and 10V voltage rating.
TABLE 2. CAPACITOR VENDOR INFORMATION
MANUFACTURER
SERIES
WEBSITE
AVX X5R www.avx.com
Murata
X5R
www.murata.com
TDK X5R www.tdk.com
Recommended PCB Layout
A correct PCB layout is critical for proper operation of the
ISL9120IR. The input and output capacitors should be positioned
as closely to the IC as possible. The ground connections of the
input and output capacitors should be kept as short as possible
and should be on the component layer to avoid problems that are
caused by high switching currents flowing through PCB vias.
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February 2, 2016
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