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Número de pieza | FJB5555 | |
Descripción | NPN Silicon Transistor | |
Fabricantes | Fairchild Semiconductor | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de FJB5555 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
No Preview Available ! FJB5555
NPN Silicon Transistor
Features
• Fast Speed Switching
• Wide Safe Operating Area
• High Voltage Capability
Application
• Electronic Ballast
• Switched Mode Power Supplies
June 2013
1 D2-PAK
1.Base 2.Collector 3.Emitter
1
B
C2
E3
Ordering Information
Part Number
FJB5555TM
Marking
J5555
Package
D2-PAK
Packing Method
Tape & Reel
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
Value
Units
BVCBO
BVCEO
BVEBO
IC
ICP
IB
IBP
TJ
TSTG
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Collector Current (Pulse)
Base Current (DC)
Base Current (Pulse)
Junction Temperature
Storage Junction Temperature Range
1050
400
14
5
10
2
4
150
- 55 to +150
V
V
V
A
A
A
A
°C
°C
Thermal Characteristics
Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
PD
Rθja(1)
Rθjc(2)
Total Device Dissipation
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case
TA = 25°C
TC = 25°C
Value
1.6
100
77.75
1.25
Units
W
W
°C/W
°C/W
Notes:
1. Device mounted on FR-4 PCB, board size= 101.5 mm x 114.5 mm.
2. Rθjc test fixture under infinite cooling condition.
© 2008 Fairchild Semiconductor Corporation
Rev. 1.1.0
1
www.fairchildsemi.com
1 page Physical Dimensions
D2-PAK
Figure 8. 2-LEAD, TO263, SURFACE MOUNT (ACTIVE)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/packing_dwg/PKG-TO263A02.pdf.
© 2008 Fairchild Semiconductor Corporation
Rev. 1.1.0
5
www.fairchildsemi.com
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet FJB5555.PDF ] |
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