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電子部品 V0603MHS03 Datasheet 詳細情報 ( 特性, スペック, ピン接続図 )

部品番号 V0603MHS03
部品説明 Multilayer High Speed Transient Voltage Surge Suppressor
メーカ Littelfuse
ロゴ Littelfuse ロゴ 
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V0603MHS03 Datasheet, V0603MHS03 PDF,ピン配置, 機能
Surface Mount Varistors
Multilayer High Speed Transient Voltage Surge Suppressor
MHS Varistor Series
The Multilayer High-Speed MHS Series is a very-low capacitance
extension to the Littelfuse ML family of Transient Voltage Surge
Suppression devices available in an 0402 and 0603-size surface
mount chip.
The MHS series provides protection from ESD and EFT in high-speed
data-line and other high frequency applications. The low capacitance of
the MHS Series permits usage in analog or digital circuits where it will
not attenuate or distort the desired signal or data.
Their small size is ideal for high-density printed circuit boards, being
typically applied to protect intergrated circuits and other sensitive
components. They are particularly well suited to suppress ESD events
including those specified in IEC 61000-4-2 or other standards used for
ElectroMagnetic Compliance (EMC) testing.
The MHS series is manufactured from semiconducting ceramics and is
supplied in a leadless, surface mount package. The MHS Series is also
compatible with modern reflow and wave soldering processes.
Littelfuse Inc. manufactures other Multilayer Varistor Series products,
see the ML, MLE, MLN and AUML series data sheets.
Features
• 3pF & 12pF Capacitance Versions Suitable for High Speed
Data-Rate Lines
• ESD Rated to IEC 61000-4-2 (Level 4)
• EFT/B Rated to IEC 61000-4-4 (Level 4)
• Low Leakage Currents
• -55oC to +125oC Operating Temperature Range
• Inherently Bi-directional
Applications
• Data, Diagnostic I/O Ports
• Universal Serial Bus (USB)
• Video & Audio Ports
• Portable/Hand-Held Products
• Mobile Communications
• Computer/DSP Products
• Industrial Instruments Including Medical
Absolute Maximum Ratings For ratings of individual members of a series, see device ratings and specifications table.
MHS SERIES
Continuous:
Steady State Applied Voltage: DC Voltage Range (VM(DC)):V0402/0603MHS03 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
V0402/0603MHS12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Operating Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 125
Storage Temperature Range (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to + 150
UNITS
V
V
OC
OC
1

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V0603MHS03 pdf, 電子部品, 半導体, ピン配列
Surface Mount Varistors
Multilayer High Speed Transient Voltage Surge Suppressor
MHS Varistor Series
Soldering Recommendations
The principal techniques used for the soldering of components in
surface mount technology are infared (IR) re-flow, vapour phase re-flow
and wave soldering. Typical profiles are shown in Figures 5, 6 and 7.
When wave soldering, the MHS suppressor is attached to the circuit
board by means of an adhesive. The assembly is then placed on a
conveyor and run through the soldering process to contact the wave.
With IR and vapour phase re-flow, the device is placed in a solder paste
on a substrate. As the solder paste is heated, it re-flows and solders the
unit to the board.
The recommended solder for the MHS suppressor is a 63/36/2
(Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also
recommends an RMA solder flux.
Wave soldering is the most strenuous of the processes. To avoid the
possibility of generating stresses due to thermal shock, a preheat stage
in the soldering process is recommended, and the peak temperature of
the solder process should be rigidly controlled. For 0402-size devices,
IR reflow is recommended.
When using a re-flow process, care should be taken to ensure that the
MHS chip is not subjected to a thermal gradient steeper than 4 degrees
per second; the ideal gradient being 2 degrees per second. During the
soldering process, preheating within 100 degrees of the solder’s peak
temperature is essentail to minimize thermal shock. Examples of the sol-
dering conditions for the MHS suppressor are given in the tables below.
Once the soldering process has been completed, it is still necessary
to ensure that any further thermal shocks are avoided. One possible
cause of thermal shock is hot printed circuit boards being removed
from the solder process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually to less than
50oC before cleaning.
6.
7.
Recommended Pad Outline
5.
TABLE 1: PAD LAYOUT DIMENSIONS
DIMENSION
A
B
C
mm in mm in
mm in
0402 1.70 0.067 0.510 0.020 0.610 0.024
0603 2.54 0.100 0.760 0.030 0.890 0.035
3





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